Product Introduction

This product is a high-power expansion module for 3D printer hot bed, equipped with a 28 * 28 * 15MM heat sink. The heat sink completely covers the high-power MOS tubes on the board, providing stronger heat dissipation and solving the problem of module heating caused by excessive power of the heating bed. This module can operate stably for a long time with a measured current of 30A under normal heat dissipation.

Product Features

1. The current can reach 30A.

2. Equipped with heat sinks.

3. The output signal of the hot bed can be directly controlled using RAMP1.4 and MKS series motherboards.

4. It can be controlled using a digital signal of 5-24V.

Product Note

1. Connect the wires first and then connect the power.

2. During use, the current should not exceed 30A.

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Payment&Transportation

Official Certificate&Certificate

Multiple product supply

Company office environment

Warehouse Real Shot

Standard packaging

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