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Rapidus collaborates with Esperanto to develop low-power AI chips

Rapidus, a Japanese wafer foundry startup, announced a memorandum of understanding with Esperanto, an American RISC-V architecture chip design company. The two sides will collaborate on the research and development of artificial intelligence (AI) semiconductors for data centers, jointly developing low-power AI chips.

2024-05-18

Honda Motor et IBM concluent un partenariat pour développer conjointement des technologies automobiles intelligentes

Honda Motor Corporation et IBM ont récemment annoncé la signature d'un protocole d'accord qui permettra de collaborer à la recherche et au développement de technologies intelligentes telles que les puces et les logiciels pour les voitures du futur.

2024-05-18

News reports that Samsung HBM3E chip has not passed NVIDIA verification

Memory giants Micron, SK Hynix, and Samsung sent samples of eight layer vertically stacked 24GB HBM3E to NVIDIA at the end of July, mid August, and early October 2023. Micron and SK Hynix HBM3E passed NVIDIA validation and received orders in early 2023, but Samsung HBM3E did not pass validation.

2024-05-18

SK Hynix will produce Power Management (PMIC) chips for Tesla

​According to reports, SK Key Foundry, a contract manufacturing subsidiary of SK Hynix, plans to produce power management chips (PMICs) installed on Tesla electric vehicles as early as July at the 8-inch wafer factory in Cheongju, Chungcheongbuk do.

2024-05-16

Sharp plans to sell semiconductor business

Recently, Japanese panel giant Sharp released its financial report, which showed a net loss of 152 billion yen in the previous quarter due to recognized impairment losses in its panel business. Sharp announced that the 10th generation panel factory (SDP) in Tujie City, which produces large-sized LCD panels for television, will cease production before the end of September, while production of small and medium-sized LCD panels will be reduced and consideration will be given to selling the camera module business and semiconductor business units such as sensors.

2024-05-16

NAND Flash Price Increase Storage Factory Armor Hero Turns Loss into Profit

Original Armor Xia released its fourth quarter (January March 2024) financial report, showing a 31% increase in revenue from last year to 322.1 billion yen, marking the first growth in seven quarters; The net profit was 10.3 billion yen, the first profit in six quarters, and a loss of 130.9 billion yen in the same period last year.

2024-05-16

Intel is about to complete financing deal to raise $11 billion for Irish wafer fabs

The report states that Intel is close to reaching a financing agreement with asset management company Apollo, and the Intel Ireland wafer plant is expected to receive $11 billion in construction funds.

2024-05-15

Institutional forecast: Global IC sales are expected to soar by 21% in the second quarter of 2024

The latest report from SEMI International Semiconductor Industry Association shows that with the increase in sales in the electronics sector, stable inventory, and increased wafer fab production capacity, there are signs of improvement in the global semiconductor manufacturing industry in the first quarter of 2024, and it is expected that industry growth will become stronger in the second half of the year.

2024-05-15

Samsung Electronics Adjusting Strategy: Future Storage Business Focus Shifts to Enterprise Sector

Recently, media reports have reported that Samsung Electronics stated in its latest earnings conference call that the focus of its future storage business will no longer be on consumer grade PCs and mobile devices, but on enterprise areas such as HBM, DDR5 server memory, and enterprise level SSDs.

2024-05-15

SK Hynix plans to launch HBM4E in 2026 with a memory bandwidth 1.4 times that of the previous generation

Kim Gwi wook, head of HBM at SK Hynix, stated that the industry's HBM technology has reached a new level, and industry demand has prompted SK Hynix to accelerate the development process. The earliest release of HBM4E memory is in 2026, and the related memory bandwidth will be 1.4 times that of HBM4.

2024-05-14

Intel appoints new head of chip foundry business

Intel announced the appointment of Kevin O'Buckley as the head of its chip foundry business services division.

2024-05-14

MEGAWIN Technology

Brand: MEGAWIN Technology introductionFounded in 1999. - Aims to become a world-class MCU supplier...

2024-05-14

MegaChips

MEMS timing devices, sensor integration LSIs, LCD timing controller LSIs, broadband power line carrier chips, image processing SoCs, etc.

2024-05-14

MediaTek

Brand: MediaTek introductionFocus on wireless communications and digital multimedia technology - c...

2024-05-14

Mechatronics

Brand: Mechatronics introductionCompany that manufactures brushless cooling fans and cooling solut...

2024-05-14

MEC Switches

Brand: MEC Switches introductionMEC Switches is a leading manufacturer of high quality switches. -...

2024-05-14

Measurement Specialties

Brand: Measurement Specialties introductionMEAS Sensors is one of the world's top sensor manuf...

2024-05-14

MEAN WELL

Brand: MEAN WELL introductionFounded in 1982 - One of the leading brand manufacturers of standard ...

2024-05-14

mCube

Brand: mCube introductionmCube is committed to promoting the "Mobile Internet of Things" - applyin...

2024-05-14

MCI Transformer

Brand: MCI Transformer introductionMCI Transformer Corporation manufactures transformers and magne...

2024-05-14

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