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2023-11-09

EMC RFLABS

Temperature compensated attenuators, loads, RF resistors, 3dB bridges, directional couplers, RF/MW cable assemblies, etc.

2023-12-14

China Mobile IoT_复制

IoT dedicated module, CM32M101A chip MCU

2023-12-14

China Mobile IoT

IoT dedicated module, CM32M101A chip MCU

2023-12-14

In Q3 2023, the top 10 global semiconductor equipment manufacturers achieved revenue exceeding $25 billion, a month on month increase of 3%

According to CINNO Research statistics, the total revenue of the global semiconductor equipment manufacturer market in the third quarter of 2023 exceeded 25 billion US dollars, a year-on-year decrease of 9% and a month on month increase of 3%.

2023-12-19

Li Jidian plans to build a factory in Japan to promote its automotive chip business

The head of Power Semiconductor Manufacturing (PSMC) recently stated that the company will use its new factory in Japan as a springboard to significantly expand its automotive semiconductor business. "Japan has huge opportunities," said Huang Chongren, CEO of Li Jidian, in a media interview. Japan has a broad market prospect and a geographical advantage where many car companies gather.

2023-12-15

Samsung's low-priced challenge to TSMC's 2nm battle begins

According to insiders, TSMC has demonstrated the process testing results of N2 (i.e. 2 nanometers) prototypes to its major customers such as Apple and Nvidia. Samsung is also actively launching a 2-nanometer prototype and adopting a low-cost strategy to attract customers such as Nvidia.

2023-12-13

Nikon launches a new ArF immersion lithography machine, which is 30% cheaper in price

Recently, Nikon announced that it will officially launch the ArF 193 nano immersion lithography machine "NSR-S636E" in January 2024, which will further improve production efficiency and etching accuracy. It is reported that Nikon's exposure machine adopts an enhanced iAS design, which can be used for high-precision measurement, circular warping, and distortion correction. The overlap accuracy (MMO) is higher, claiming to not exceed 2.1 nanometers.

2023-12-12

Intel's appeal wins $2.18 billion compensation judgment overturned

The Federal Circuit Court of Appeals in the United States has announced the overturning of a 2021 ruling by a Texas court jury, which found Intel to be liable for $2.18 billion in compensation to patent technology company VLSI for patent infringement. This is one of the largest rulings in US patent history. The appellate court held that Intel's infringement of one patent involving $675 million in compensation does not constitute infringement, while the infringement of the other patent involving $1.5 billion in compensation remains valid, but the amount of compensation needs to be reconsidered by the Texas court.

2023-12-08

Spend 5 billion euros! STMicroelectronics will build a new SiC wafer factory

Recently, STMicroelectronics has decided to further expand its production facilities by establishing a brand new silicon carbide (SiC) semiconductor wafer fab in Catane, Sicily, Italy. The total investment amount is up to 5 billion euros, and the wafer factory will specialize in producing silicon carbide chips, which are key technologies for electric vehicles and have strong growth potential.

2023-12-06

AMD plans to establish the world's largest design center in India

AMD announced the opening of its largest global design center, AMD Technostar, in Bangalore, India. This move is also part of AMD's global expansion, aimed at enhancing its competitiveness in the fiercely competitive semiconductor market.

2023-12-05

Apple may abandon independent research and development of 5G modem chips

Supply chain sources have revealed that Apple may decide to stop developing its self-developed 5G modem chip after multiple failed attempts to improve it.

2023-12-04

Samsung Electronics CIS products have seen a maximum price increase of 30%

After a long period of downturn, the consumer electronics industry has finally ushered in the dawn of recovery. Recently, media reports have reported that Samsung Electronics has issued a CIS price increase notice to customers, with an average increase of up to 25% in the first quarter of next year, and some products have seen the highest increase of up to 30%. The price increase mainly focuses on products with specifications above 32 million pixels.

2023-12-01

Samsung suspends NAND flash memory shipments, Q4 storage chip contract price exceeds expectations

Although most terminal products have had mediocre sales during recent promotional periods, the spot prices of storage chips are still showing an upward trend despite significant production cuts and production control by Samsung, SK Hynix, and Micron. Among them, due to more severe losses, the increase in NAND storage chips is more significant.

2023-12-01

SK Hynix plans to adopt 2.5D fanout packaging technology for the next generation HBM

SK Hynix is preparing to launch a 2.5D fanout package as its next-generation storage semiconductor technology. SK Hynix has achieved success in the high bandwidth memory (HBM) field this year and is confident in the next generation chip technology field, seemingly ensuring its technological leadership by developing "professional" memory products. According to South Korean media Business Korea, SK Hynix is preparing to integrate 2.5D fanout packaging technology into its next generation DRAM after HBM.

2023-11-29

Mitsubishi Electric collaborates with Anse to develop SiC power semiconductors

Recently, Mitsubishi Electric and Nexperia announced their joint development of efficient silicon carbide (SiC) MOSFET discrete power semiconductors. Mitsubishi Electric will develop and supply SiC MOSFET chips to Nexperia, while Nexperia will develop SiC discrete components equipped with Mitsubishi Electric's chips.

2023-11-28

The storage market is deadlocked, and buyers and sellers are engaged in a tug of war

According to reports, the DRAM spot market prices have been in a stalemate recently. Among them, the price of DDR5 16G showed a significant decline in the first half of the past week and then slightly increased, while the price of DDR4 8G remained stable and slightly decreased.

2023-11-27

The institution predicts that the annual growth rate of the HBM market will reach 52% in the next four years

Due to the surge in demand for artificial intelligence, the prices and demand for HBM and DDR5 are both increasing. The price of HBM is 5-6 times that of existing DRAM products; The price of DDR5 is also 15% to 20% higher than that of DDR4. From this year to 2027, the annual growth rate of DRAM market revenue is expected to be 21%, while the HBM market is expected to soar by 52%. HBM's share of DRAM market revenue is expected to exceed 10% this year and approach 20% by 2027.

2023-11-25

German subsidies or current variables affecting Intel and TSMC's plans to build factories

Recently, a ruling by the Federal Constitutional Court of Germany resulted in the postponement of the country's 2024 federal budget. All government expenditures may be subject to scrutiny, which could result in chip manufacturers such as Intel and TSMC losing significant subsidies.

2023-11-24

Botong's $69 billion acquisition of VMWare has been conditionally approved by China

Chip giant Broadcom announced on Tuesday that it plans to complete a $69 billion acquisition of cloud computing company VMWare on Wednesday. The merger between Broadcom and VMware is one of the largest technology industry transactions in history, and although it has been approved by the European Union, the UK, South Korea, and Japan, it still requires approval from China.

2023-11-23

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