86-755-88844016 +852 2632 9637 6*12 hours online call

What are the main characteristics of optoelectronic devices

Optoelectronic devices, as an important component of modern technology, are increasingly widely used in fields such as communication, energy, and detection. The main characteristics of optoelectronic devices are the foundation of their functions and applications. This article will explore these characteristics in detail and explain their applications in modern technology.



Brand: SLKORintroductionSLKOR is a power component design, production and sales company - the comp...



Brand: SmaliteintroductionFocus on the R&D, production and sales of LED optoelectronic product...



TFT-LCD modules, TFT-LCD panels, energy storage/management systems, touch solutions, etc.


The working principle and classification of electromagnetic voltage transformers

Electromagnetic voltage transformers are commonly used in power systems to measure voltage on high-voltage transmission lines. They can also be used to monitor the voltage waveform and amplitude in the power system, in order to timely detect faults and problems in the power system. In this article, we will provide a detailed introduction to the working principle and classification of electromagnetic voltage transformers.


Differences between thermal relays and thermal overload relays

Thermal relays and thermal overload relays are common electrical protection devices, but their working principles and protection objects are different. In this article, we will provide a detailed introduction to the differences between thermal relays and thermal overload relays.


Types and Packaging of Tantalum Capacitors

Tantalum capacitors are electronic components that use tantalum metal as the electrode material. They are usually divided into two types: polarized and unpolarized, and come in various packaging forms. In this article, we will discuss in detail the types and packaging of tantalum capacitors.


The difference between thermal relays and fuses

Thermal relays and fuses are common electrical components that play a protective role in circuits. Although they can both interrupt the circuit, there are some differences between them. In this article, we will provide a detailed introduction to the differences between thermal relays and fuses.


FT2232 Development Board

A development board designed with FT2232 chip, which fully leads out the IO port, can be used to design an interface expansion board based on this.


AI high-performance computing - integrated storage and computing

Integrated storage and computing or in memory computing is the complete integration of storage and computing, directly utilizing memory for data processing or computation. Under the traditional von Neumann architecture, data storage and computation are separated. Due to the increasing performance gap between storage and computation, the speed at which the processor accesses stored data is much lower than the processor's computation speed. The energy consumption of data transportation between memory and main memory is also much higher than the energy consumed by the processor's computation.


AI High Performance Computing - Google TPU

Since Google launched the first generation self-developed artificial intelligence chip Tensor Processing Unit (TPU) in 2016, it has been upgraded to the fourth generation TPU v4 after several years of development (as of the end of 2022). The TPU architecture design also achieves efficient computation of network layers such as deep learning convolutional layer and fully connected layer by efficiently parallelizing a large number of multiplication and accumulation operations.


AI High Performance Computing - Cambrian NPU

The Cambrian period was one of the earliest AI chip companies in China to study. The design of their AI chip NPU (Neural Network Processing Unit) originated from a series of early AI chip architecture studies, mainly including DianNao, DaDianNao, PuDianNao, ShiDianNao, Cambricon-X, and other research achievements.


AI High Performance Computing - AI Chip Design

The simplest and most direct design approach for AI chips is to directly map neurons to hardware chips, as shown in the figure. The Full Hardware Implementation scheme maps each neuron to a logical computing unit and each synapse to a data storage unit. This architecture design can achieve a high-performance and low-power AI chip, such as an Intel ETANN chip. In the full hardware implementation scheme, the output data of the previous layer is multiplied by the weight, and the results of the multiplication are then added up, and then output to the next layer for calculation through an activation function. This architecture design tightly couples computing and storage, allowing the chip to avoid large-scale data access while performing high-speed computing, improving overall computing performance while also reducing power consumption.


AI High Performance Computing - AI Computing Features

AI computing characteristicsDesigning and deploying a specialized chip requires balancing various in...


AI High Performance Computing - AI Specific Chip

Currently, artificial intelligence (AI) computing mainly refers to neural network algorithms represented by deep learning. Traditional CPUs and GPUs can be used to perform AI algorithm operations, but they are not designed and optimized for deep learning characteristics, so they cannot fully adapt to AI algorithm characteristics in terms of speed and performance. Generally speaking, AI chips refer to ASICs (specialized chips) specially designed for AI algorithm characteristics.


Artificial intelligence chips are exploding! Three major mainstream AI chips, leading companies are fully sorted out

AI chips are the core component of AI server computing power, and with the rapid growth of AI computing power, there will be a greater demand for AI chips. According to the survey data, it is expected that the market size of China's artificial intelligence chips will reach 85 billion yuan in 2022, 103.9 billion yuan in 2023, and 178 billion yuan in 2025.


Isolation power supply uses a boost controller MAX668 to generate three isolation voltages for the slice power supply

This application note shows a power supply that generates three isolation voltages for a slice. The isolation power supply uses a boost controller MAX668 with a flyback transformer for -24V and -72V outputs, and uses an optocoupler to isolate the feedback signal. The linear regulator MAX8867 provides a 3.3V output.


Usage and precautions of voltage regulator diodes

Zener diodes can be used to stabilize power supplies and protect other electronic components from excessive voltage damage. It can also be used in various circuits such as oscillation circuits, modulation circuits, switching circuits, etc. to achieve different functions. When using a voltage regulator diode, it is necessary to pay attention to some usage methods and precautions.


Working Principle and Common Fault Handling of Thermal Resistors

A thermistor is an electronic component whose resistance varies with temperature, commonly used in fields such as temperature measurement, electronic temperature control, electronic temperature compensation, and automatic temperature control. The working principle of thermal resistors mainly involves the selection of materials, measurement of resistance values, and application of temperature sensitive characteristics. The following will provide a detailed introduction to the working principle and common fault handling of thermal resistors.


Application scenarios and precautions for converters

DC-DC converter is a common power converter device mainly used to convert one DC voltage to another voltage level. Due to its high power and efficiency, small size, and light weight, DC-DC converters are widely used in fields such as computer, communication, industrial automation, automotive, aerospace, etc.


User Info:
Phone number
  • +86
  • +886
  • +852
Company Name
Product model
Comment message