86-755-88844016 6*12 hours online call

Renesa Electronics collaborates with Meibei Sanmei to develop an angle sensor stepper motor control scheme

Ruisa Electronics Co., Ltd., a leading global semiconductor solution supplier, and Meibei Sanmei Co., Ltd., a leading global stepper motor supplier, have announced the joint development of stepper motor and motor control solutions based on rotary transformers (angle sensors), and have been optimized for machinery, office automation (OA) equipment, and medical/nursing equipment. The stepper motor and motor control solution based on rotary transformer sensors jointly developed by Ruisa Electronics and Meibei Sanmei can meet the needs of higher precision control, miniaturization, and stronger resistance to environmental impacts of motors.


It is reported that TSMC has collaborated with Broadcom, Nvidia, and others to develop silicon photonic technology

According to the news, TSMC has collaborated with major clients such as Broadcom and Nvidia to develop new products such as silicon photonic technology and co packaging optical components. The process technology has been extended from 45nm to 7nm, with large orders starting from the second half of next year at the earliest. It is expected to enter the stage of large-scale production by 2025.


Intel Announces a New OEM Agreement with Gaota Semiconductor

Recently, Intel Foundry Services (IFS) announced a new OEM agreement with Tower Semiconductor, an Israeli semiconductor foundry.


Vishay Launches Industry Advanced Standard Rectifier and TVS Two in One Solution

The space saving device adopts a small FlatPAK 5 x 6 package, with built-in 3 A, 600 V standard rectifier and 200 W TRANSZORB ® TVS


Automotive chip race track is hot, TSMC and Samsung actively layout

With the rapid growth of demand for electric vehicles and autonomous vehicle, the market demand for advanced high-performance semiconductor products is also surging. The growth of this demand has prompted the semiconductor industry to shift from traditional mature processes to more advanced processes, making the competition for advanced processes in automotive electronics more intense.


STMicroelectronics Announces Mass Production of PowerGaN Devices

STMicroelectronics announced that it has started mass production of enhanced mode PowerGaN HEMT (High-electron-mobility transistor) devices that can simplify the design of efficient power conversion systems. STPOWER ™ GaN transistors have improved the performance of wall power adapters, chargers, lighting systems, industrial power supplies, renewable energy generation, automotive electrification, and other applications.


Infineon Expands Production to Build the World's Largest 8-inch SiC Wafer Factory

Recently, power semiconductor giant Infineon announced plans to invest up to 5 billion euros in the next five years to build the world's largest 8-inch SiC power wafer factory in Malaysia.


Infineon High Voltage Superjunction MOSFET Series Products Add Industrial Grade and Vehicle Gauge Grade Devices

In static switching applications, power supply design focuses on minimizing conduction losses, optimizing thermal performance, achieving compact and lightweight system design, while achieving high quality at low cost. In order to meet the needs of new generation solutions, Infineon Technologies Technology Co., Ltd. is expanding its CoolMOS ™ The product lineup of S7 series high-voltage superjunction (SJ) MOSFETs. This series of devices are mainly applicable to applications such as switching power supply (SMPS), solar energy system, battery protection, Solid-state relay (SSR), motor starter and solid state circuit breaker, as well as Programmable logic controller (PLC), lighting control, high-voltage electronic fuse/electronic circuit breaker and (hybrid) electric vehicle on-board charger.


AMD plans to invest approximately $400 million in expanding the Indian market within five years

Recently, AMD announced that it will invest approximately $400 million in expanding in India over the next five years. This major decision will have a positive impact on the Indian Semiconductor industry, and it is also a strategic step for AMD to expand its global business.


ST STMicroelectronics Q2 revenue growth 12.7%, auto business growth for four consecutive quarters

STMicroelectronics held the financial statement explanation meeting for the second quarter of 2023. Data shows that STMicroelectronics's net income in the second quarter was 4.33 billion US dollars, up 12.7% year on year. Gross margin is 49%, operating profit margin is 26.5%, and net profit is $1 billion; In the first half of the year, the net income was US $8.57 billion, up 16.1% year on year, the Gross margin was 49.3%, and the net profit was US $2.05 billion. Jean Marc Chery, president of STMicroelectronics, said that the net income in the second quarter increased by 12.7% year on year, mainly due to the continuous strong growth of automobile and industrial businesses.


Meiguang Launches 8-Layer Stacked 24GB Capacity Second Generation HBM3 with 2.5x Improved Memory Performance

Recently, Micron Technology announced that it has begun to send samples of its first 8-high 24GB HBM3 Gen2 memory product, with bandwidth greater than 1.2TB/s and pin speed greater than 9.2Gb/s, which is 50% higher than the current HBM3 solution, and its performance per watt is 2.5 times higher than previous generations of products.


Intel and Ericsson Collaborate to Build New 5G Chips Using 18A Technology

Recently, Intel will collaborate with Swedish telecommunications equipment manufacturer Ericsson to manufacture customized chips for Ericsson's 5G network equipment using its state-of-the-art 18A process and manufacturing technology.


STM32 STM32 USB PD microcontroller of STM32 now supports UCSI specification

STMicroelectronics, a new USB Type-C, is added to STM32 microcontroller (MCU) software ecosystem of STM32 ® The Connector System Interface (UCSI) software library accelerates the development of USB-C Power Supply (PD) applications.


Germany plans to allocate funds to increase chip production by over 70%, which will flow to Intel and TSMC

According to media reports, the German government plans to allocate 200 billion euros (approximately 220 billion US dollars) to support the domestic semiconductor manufacturing industry. Participants in the negotiations revealed that the funds will be extracted from the Climate and Transformation Fund and distributed to local and international companies before 2027.


TDK Launches a New Embedded Motor Controller

TDK has developed a new embedded motor controller that can output 2 A peak current for driving brushless DC motors (BLDC) and brushless DC motors (BDC)


ASML Announces 2023Q2 Financial Report: EUV Growth Slows and DUV Enters an Explosion Period

As one of the core equipment in semiconductor manufacturing, Stepper is very important. Only ASML can produce EUV Stepper for processes below 7nm, with a price of more than 1 billion. However, this year, the momentum of EUV has stalled, and the demand for DUV Stepper has skyrocketed.


Chip giant ROHM plans to jointly acquire Toshiba for $2.16 billion

According to reports, Japanese chip manufacturer Roma will provide a total of 300 billion yen (approximately $2.16 billion) in funds to a consortium led by private equity firm Japan Industrial Partners (JIP) for the proposed acquisition of Toshiba. At a recent board meeting, Rom decided that if the tender offer is successful, he will invest 100 billion yen in the investment fund led by JIP and also purchase 200 billion yen of preferred shares issued by affiliated companies established for the acquisition.


Onsemi and BorgWarner signed a SiC cooperation agreement of more than 1 billion dollars

Onsemi, an intelligent power supply and intelligent perception technology company, and BorgWarner, an innovative and sustainable mobile travel solution provider, have expanded their strategic cooperation in silicon carbide (SiC), with a total agreement value of more than $1 billion.


Samsung Electronics Announces Development of Industry's First GDDR7 DRAM

The official website of Samsung Electronics announced that it has completed the development of the industry's first graphics Double data rate 7 (GDDR7) DRAM. This year, it will first be installed on the next generation systems of major customers for verification. It is reported that this product is expected to be extended to future applications such as artificial intelligence, High-performance computing (HPC) and automobiles.


Samsung is developing LEDoS micro displays for the AR field

Samsung Display, a subsidiary of Samsung, has recently confirmed that they are developing LEDoS silicon based LED display technology for augmented reality and are expected to bring the next generation of AR head displays in the coming years. Among them, Samsung's goal is to make LEDoS possess all the qualities of OLEDoS while reducing its limitations.


User Info:
Phone number
  • +86
  • +886
  • +852
Company Name
Product model
Comment message