Internal structure and functional use of precision potentiometer
Precision potentiometer, also called precision adjustable potentiometer, is a variable resistor that...
Ruisa Electronics Announces Completion of Panthronics Acquisition to Acquire Its NFC Technology
Recently, Japanese semiconductor solution supplier Reza Electronics announced that it has acquired Panthronics AG, a fabless semiconductor company specializing in high-performance wireless products. At the same time, Reza Electronics has also released 13 "successful product portfolio" solution designs, combining Reza Electronics' products with Pantronics' Near Field Communication (NFC) technology, extending the breadth and depth of Reza Electronics' product lineup.
SK Hynix 5th generation 10 nanometer level DDR5 DRAM development completed
SK Hynix announced that its fifth generation 10 nanometer process, 1bnm, has been validated and will provide support for the next generation DDR5 and HBM3E solutions. The SK Hynix 1bnm process will provide a speed of 6.4 Gbps for DDR5 and 8 Gbps for HBM3E.
Vishay launches a new ISOA thick film power resistor with high pulse processing capability
Recently, Vishay Intertechnology, Inc. announced the launch of a new thick film power resistor - IOA, which has passed AEC-Q200 certification and is packaged in a small SOT-227 package, and can be directly installed on a heat sink. Vishay MCB ISOA has high pulse processing capability, with a power dissipation of up to 120 W at a bottom shell temperature of 85 ° C. It can be equipped with NTC thermistors for internal temperature monitoring, and pre coated with phase change thermal interface materials (PC-TIM) to improve mounting efficiency.
Samsung spends a huge amount of money building semiconductor settlements to attract investment from manufacturers
According to reports, semiconductor giant Samsung Electronics plans to invest 300 trillion Korean won (approximately 1.6 trillion yuan) in the next 20 years to build a new semiconductor manufacturing settlement near Seoul, South Korea. By building facilities nearby and shortening the distance with customers, the delivery time caused by trial and error can be minimized, potentially improving development efficiency.
MediaTek and NVIDIA reached a cooperation to develop AI intelligent cockpit solutions
MediaTek announced a cooperation agreement with NVIDIA to provide a complete AI intelligent cockpit solution for software defined cars. The cooperation between both parties will fully leverage the advantages of their respective automotive product portfolios and jointly provide excellent solutions for the new generation of intelligent vehicles.
DRAM industry Q1 revenue decreased by 21.2% month on month for three consecutive quarters showing a downward trend
According to TrendForce consulting research, the revenue of the DRAM industry in the first quarter of this year was approximately 9.66 billion US dollars, a decrease of 21.2% month on month, and has continued to decline for three more quarters. In terms of shipment volume, only Meiguang has increased, while the rest have declined; The average sales unit price of all three major manufacturers has decreased. At present, due to oversupply but not improvement, prices continue to decline. However, after the original factory gradually reduces production, the price decline of DRAM in the second half of the year is expected to converge quarter by quarter. Looking ahead to the second quarter, although the shipment volume has increased, prices continue to decline, so it is expected that revenue growth will be limited.
News says Samsung Display will use hybrid technology OLED panels for cars
According to reports, Samsung Display, which supplies rigid OLED panels to car manufacturers, has plans to use hybrid technology OLED panels for cars. Hybrid OLED is a new method of applying thin film encapsulation (TFE) to glass substrates. Previously, Samsung monitors had been applying rigid OLEDs to automotive displays.
Q2 performance of applied materials exceeded expectations by 6% compared to the same period last year
Recently, semiconductor equipment giant Applied Materials (AMAT) released its second quarter financial report. The financial report shows that the operating revenue of Applied Materials reached $6.63 billion, a year-on-year increase of 6%. After adjustment, the net profit per share after tax was $2.0, a month on month increase of 8%. The financial performance of the operating conditions exceeded analysts' expectations.
Global semiconductor sales decreased by 8.7% to $119.5 billion in Q1 2023
Recently, WSTS released the latest data showing that global semiconductor sales in the first quarter of 2023 were $119.5 billion, a decrease of 8.7% month on month and 21.3% year on year. This is the largest quarterly and year-on-year decrease since the first quarter of 2019. In addition, Intel defeated Samsung to regain the top spot in the global semiconductor industry.
Texas Instruments TI Launches Silicon Carbide Gate Driver
Texas Instruments (TI) today launched a highly integrated functional safety compliant isolated gate driver, helping engineers design more efficient traction inverters and extend the range of electric vehicles (EVs) to a greater extent. The new UCC5880-Q1 enhanced isolated gate driver provides functionality that enables electric vehicle powertrain engineers to achieve their safety and performance goals while increasing power density, reducing system design complexity and cost.
Samsung Electronics has officially mass-produced 12 nanometer level DDR5 DRAM
Samsung Electronics announced today that the 16Gb DDR5 DRAM using 12 nanometer process technology has entered the mass production stage. This move to apply cutting-edge manufacturing processes has once again consolidated Samsung's leading position in cutting-edge DRAM technology.
Microchip introduces two new clock restorers and signal repeaters
A standard universal serial bus or USB connection is the industry mainstream way of transmitting data between two devices. The extensive addition of electronic components in applications in the automotive, industrial, and consumer industries has stimulated the demand for long-distance USB cabling products. In order to provide the market with a long-distance and reliable USB solution, Microchip Technology Inc. today announced the launch of two new clock restorers/signal repeaters. EQCO510 for automobiles and EQCO5X31 for industrial use clock restorer/signal repeater devices can expand the USB coverage to 15 meters to achieve maximum coverage, and are compatible with the first generation ultra high-speed protocol of USB 3.2.
Samsung and Naver plan to jointly launch AI chips and plan to release them in the second half of this year
Two South Korean technology giants, Samsung Electronics and Naver, have reached a cooperation agreement to jointly develop a generative artificial intelligence platform that will be used for enterprise applications and aimed at competing with global AI tools such as ChatGPT. According to foreign media reports, both parties have officially signed a cooperation agreement.
Western Data and Armor Accelerate Merger Negotiations to Cope with the Declining Storage Market
With the decline in flash memory demand, Japanese Armor and American chip manufacturer Western Data are accelerating their merger and have developed a transaction structure. The industry believes that the integration of the two parties' affairs will enhance their competitiveness when facing competitors such as Samsung in South Korea.
Electric Equipment and Liandian Achieve Cooperation to Achieve Mass Production of New Generation Electric Vehicle IGBT
DENSO, a Japanese automotive electronics supplier, and USJC, a Japanese subsidiary of wafer foundries, jointly announced that the insulated gate bipolar transistor (IGBT) produced jointly by the two companies has entered mass production at USJC's 12 inch wafer factory. It is expected that by 2025, the monthly production will reach 10000 wafers. This cooperation will help meet the demand of the electric vehicle market, improve production efficiency, and reduce costs.
According to the news, Samsung Electronics' chip business may lose 4 trillion Korean won in Q1
Samsung Electronics expects its operating profit in the first quarter of this year to decline by nearly 96% year-on-year, to 600 billion Korean won. This number is far below the 14.12 trillion won in the same period last year and also lower than the market average expectation. According to foreign media reports, Samsung Electronics performed poorly in the first quarter, mainly due to a decline in chip demand. Analysts have predicted that the device solutions department where Samsung's chip business is located may experience an operating loss of up to 4 trillion won in the first quarter.
STM Announces Important Agreement with ZF to Provide High Performance Silicon Carbide Devices
According to media reports, STM has signed a long-term supply agreement with ZF to provide silicon carbide devices to ZF. Silicon carbide devices are high-performance and highly reliable power electronic devices commonly used in switch and control circuits in automotive power systems. STM's silicon carbide devices will provide higher performance, lower power consumption, and greater reliability, providing better solutions for ZF's automotive power system.
Bourns leads the acquisition of resistor manufacturer Riedon, Inc
Bourns is a leading resistance manufacturer that recently announced the successful acquisition of Riedon, Inc. Riedon is a professional resistor manufacturer with years of experience and expertise in the field of resistors.
Ruisa Electronics Releases First Microcontroller Based on 22 Nanometer Process
According to the official WeChat account of Renesa Electronics, semiconductor solution supplier Renesa Electronics has announced the launch of its first microcontroller (MCU) based on the 22nm process. Ruisa has now provided new device samples to some users and is expected to be fully launched in the fourth quarter of 2023.
The semiconductor packaging material market may recover in the second half of 2023
Recently, TECHCET released its latest outlook for the semiconductor packaging material market, which is expected to total approximately $26.1 billion in 2022 and reach $30 billion by 2027.