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Samsung announces chip manufacturing technology roadmap

According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.


NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory

On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.


Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time

Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.


Passive component leader National Giant plans to transform into IDM company

In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.


Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard

According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".


Samsung Electronics has basically completed the development of the 8nm version of eMRAM memory process upgrade

Samsung Electronics representative stated at the AI-PIM seminar in South Korea that they are gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed. As a new type of memory, MRAM is based on the principle of magnetism and has non-volatile properties. It does not need to constantly refresh data like DRAM memory, making it more energy-efficient and efficient; At the same time, the write speed of MRAM is 1000 times that of NAND, supporting applications that require higher write rates.


From January to April, the production of integrated circuits increased by 37.2% year-on-year, reaching 135.4 billion blocks

Recently, the official website of the Ministry of Industry and Information Technology showed that from January to April, China's electronic information manufacturing industry saw steady growth in production, export recovery improved, efficiency continued to improve, investment maintained rapid growth, and the overall growth trend of the industry was significant.


The NAND Flash market saw growth in the first quarter of 2024

According to TrendForce consulting research, due to the widespread use of enterprise SSDs in artificial intelligence servers starting in February 2024, as well as PC and smartphone manufacturers continuing to increase inventory to combat price increases, NAND Flash revenue increased by 28.1% month on month in the first quarter of 2024, reaching $14.71 billion.


TSMC predicts that the AI accelerator market may grow by 250%

According to information disclosed by TSMC at its technology seminar, the semiconductor market only began to recover in the second half of last year, so analysts are cautious about this year's growth. Although the growth expectations for the PC and smartphone sectors are only in single digits this year, there is one semiconductor market expected to grow by about 250%, which is the AI accelerator market.


Microchip releases TimeProvider ® 4100 Master Clock V2.4 Firmware

Key infrastructure such as utilities, transportation, and mobile networks rely on time to achieve network synchronization. The main source of time is national time service systems such as Global Positioning System (GPS), but GPS signals are susceptible to interference and deception attacks. In order to continue providing secure timing solutions for critical infrastructure operators, Microchip Technology Today Releases TimeProvider ® 4100 Master Clock V2.4 firmware with embedded BlueSky ™ The firewall function can detect potential threats and verify GNSS before using signals as a time benchmark.


South Korea announces plans to invest 26 trillion Korean won to support the chip industry

According to reports, the South Korean government has announced a total of 26 trillion won chip support plan to help South Korean companies such as Samsung Electronics and SK Hynix maintain their leading position in increasingly fierce competition.


The completed production capacity of Toshiba's 300mm wafer power semiconductor manufacturing plant may double

Toshiba Electronic Components and Storage Devices Co., Ltd. (hereinafter referred to as Toshiba) announced on May 23 the completion of its 300mm wafer power semiconductor manufacturing plant and office building.


Strong Market Demand TSMC Plans to Build Seven New Factories in 2024

TSMC executive Huang Yuanguo stated that in response to strong demand for high-performance computing (HPC) and smartphones, TSMC continues to actively expand production this year and will build seven factories. It is expected that the 3-nanometer process capacity will increase by three times compared to 2023.


Amazon AWS claims that it has not stopped any Nvidia chip orders

Previously, it was reported that AWS, a subsidiary of Amazon, has suspended orders for Nvidia Hopper chips in anticipation of more powerful new ones. AWS issued a clarification statement afterwards stating that, AWS has not suspended any orders from NVIDIA.


ASML's claim that TSMC lithography machines can be remotely paralyzed has attracted attention

It is said that the EUV extreme ultraviolet lithography machine purchased by TSMC comes from the Dutch company ASML (Asma), which reportedly hides a potential fatal backdoor that can remotely trigger self destruct function if necessary.


The construction progress of Rapidus's first trial production line has reached 30% smoothly

Junichi Kochi, President of Rapidus, a Japanese advanced process manufacturing plant, told the Japanese Minister of Economy, Trade and Industry, Ken Saito, The construction of the Rapidus wafer factory project has been smooth, and the progress of the first trial production line has reached 30%. Jian Saito visited Chitose City, Hokkaido last week and inspected the IIL-M wafer factory site in Rapidus.


Samsung and SK Hynix hold a conservative attitude towards increasing production of general storage chips

Samsung and SK Hynix still maintain a conservative attitude in increasing the production of standard DRAM and NAND chips. It is reported that the contract price of 8Gb DDR4 DRAM universal memory increased by 17% month on month in April, but the price of 128Gb (16Gx8) MLC universal flash memory for portable storage devices such as flash drives remained unchanged.


Bourns launches shielded power inductors with extremely high current capacity

Bourns, a globally renowned supplier of electronic components for power, protection, and sensing solutions, has launched a new series of shielded power inductors with extremely high current capacity, low howling noise, and low DCR. With the rise of more and more data-driven applications, the demand for Power Bead magnetic bead inductors that can match their abnormally high current specifications is also increasing. Bourns ® SRP1060VR is designed to meet these requirements and is suitable for servers and workstations, data centers, data networks and storage systems, laptops and desktops, graphics cards, and various battery powered systems.


SK Hynix has seen a significant increase in deposits from HBM's large order customers

According to SK Hynix regulatory documents, customer deposits increased significantly again in the first quarter of 2024. SK Hynix stated that it received a prepayment of 56.1 billion Korean won and customer liabilities (customer deposits) of 2.7459 trillion Korean won.


TSMC launches N4e special process to increase production capacity by 50%

TSMC announced at the 2024 European Technology Forum that it plans to expand its special process capacity by 50% in the future and enhance the resilience of its semiconductor supply chain.


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