Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.

It is reported that in March 2023, Mitsubishi Electric announced an investment of approximately 100 billion yen (approximately 4.6 billion yuan), most of which will be used to build a new 8-inch SiC wafer plant and strengthen related production facilities. The factory will have its own facility in the Ishii area of Kumamoto Prefecture, producing 8-inch SiC wafers and introducing a clean room with advanced energy efficiency and high automation production efficiency. In addition, Mitsubishi Electric will strengthen its production facilities for 6-inch SiC wafers to meet the growing market demand.

Masayoshi Takemi, Senior Executive Officer and General Manager of Mitsubishi Electric's Semiconductor and Devices Division, said at the meeting, "Consultations regarding SiC power semiconductors in automotive and industrial applications are increasing, and we hope to address the growth in demand by producing 8-inch products (with higher production efficiency compared to existing products)."

Mitsubishi Electric previously stated that its wafer production capacity in 2026 will expand by about five times compared to 2022. Mitsubishi Electric's goal is to increase the sales proportion of SiC in its power semiconductor business to over 30% by fiscal year 2030.

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