Hi,welcome
+86 135 5637 6665 +852 2632 9637 6*12 hours online call
Samsung announces chip manufacturing technology roadmap
2024-06-13

According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.


According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.


Samsung predicts that by 2028, its list of AI related customers will expand fivefold and revenue will increase nine times. The report pointed out that Samsung Electronics has announced a series of layouts for future artificial intelligence related chips.


In its published technology roadmap, an important innovation is the adoption of backside power supply network technology. According to Samsung, this technology has improved power, performance, and area compared to the traditional first generation 2-nanometer process, while significantly reducing voltage drop. Samsung also emphasized its comprehensive capabilities in logic, memory, and advanced packaging. Samsung believes that this will help the company win more outsourcing manufacturing orders for artificial intelligence related chips.


In addition, Samsung has also announced a Gate All Around (GAA) processor based on AI design, with the second-generation 3-nanometer GGA planned for mass production in the second half of this year and providing GAA in the upcoming 2-nanometer process. The company also confirmed that its preparation work for 1.4nm is progressing smoothly and is expected to achieve mass production by 2027.


According to the latest data from market research firm TrendForce Consulting, Samsung Foundry's revenue decreased by 7.2% to $3.36 billion in the first quarter due to the impact of the off-season of the smartphone season, as well as the shift of Android mid range smartphones and peripheral companies to domestic substitution, resulting in weak momentum in advanced processes and peripheral ICs. The market share remained at 11%.


三星_20240613152951_144



It is worth noting that despite Samsung vigorously promoting its GAA technology on forums and planning to start mass production of the second generation 3nm process in the second half of this year, Samsung executives remain silent on the progress of cooperation with key customers such as Nvidia. This also reflects to some extent that Samsung may still face significant challenges in acquiring high-end customers.


The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!

Hot news
Differences in the Performance of LED Core Technologies
The core performance indicators of LED devices are mainly reflected in the following six aspects
PCB wiring principles and techniques
1、 Manually wiring as much as possible
Mikroe Motion 2 Click Board Product Introduction
Mikroe Motion 2 Click is based on the Panasonic EKMC1607112 PIR motion sensor and is used as a human motion detector
SK Hynix develops a new generation of mobile NAND flash memory solutions
As the industry's highest-performance product, it will begin mass production in the third quarter of this year and be integrated into edge-side AI smartphones
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
Samsung Electronics has basically completed the development of the 8nm version of eMRAM memory process upgrade
Samsung Electronics representative stated at the AI-PIM seminar in South Korea that they are gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed. As a new type of memory, MRAM is based on the principle of magnetism and has non-volatile properties. It does not need to constantly refresh data like DRAM memory, making it more energy-efficient and efficient; At the same time, the write speed of MRAM is 1000 times that of NAND, supporting applications that require higher write rates.
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message