On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
In addition, World Advanced and NXP have committed to investing a total of $1.9 billion in long-term capacity deposits and usage fees, with the remaining funds to be provided by other units.
World Advanced mentioned that this joint venture company will start building its first wafer factory in the second half of 2024 after obtaining approval from relevant regulatory authorities, and is expected to start mass production in 2027. In 2029, the monthly production capacity of the wafer factory is expected to reach 55000 12 inch wafers, creating approximately 1500 job opportunities. Meanwhile, after the successful mass production of the first wafer factory, both parties will consider building a second wafer factory.
It is reported that this wafer fab will adopt technologies ranging from 130nm to 40nm to produce mixed signal, power management, and analog products to support the demands of terminal markets such as automotive, industrial, consumer electronics, and mobile devices. The related technology licensing and transfer are expected to come from TSMC in the future.
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