The completed production capacity of Toshiba's 300mm wafer power semiconductor manufacturing plant may double_News_ALL NEW SEMI (ANSC)

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The completed production capacity of Toshiba's 300mm wafer power semiconductor manufacturing plant may double

2024-05-24

Toshiba Electronic Components and Storage Devices Co., Ltd. (hereinafter referred to as Toshiba) announced on May 23 the completion of its 300mm wafer power semiconductor manufacturing plant and office building.

Toshiba has revealed that the factory is currently working intensively on the installation of related equipment, with the goal of officially launching mass production in the second half of the 2024 fiscal year. Once the first phase of the project is fully put into operation, the production capacity of Toshiba Power Semiconductor (mainly MOSFET and IGBT) will be 2.5 times that of the investment plan formulated in the 2021 fiscal year. The construction and operation of the second phase will be decided based on market conditions.

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The new manufacturing building follows Toshiba's Business Continuity Plan (BCP) and will make a significant contribution to Toshiba's BCP: it has an isolation structure that absorbs seismic impacts and redundant power sources.

The official press release shows that energy from renewable energy and building roof solar panels (on-site PPA mode) will enable the facility to meet 100% of its electricity demand through renewable energy.

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