TSMC executive Huang Yuanguo stated that in response to strong demand for high-performance computing (HPC) and smartphones, TSMC continues to actively expand production this year and will build seven factories. It is expected that the 3-nanometer process capacity will increase by three times compared to 2023.

As the world's largest wafer foundry, TSMC seems to never hesitate to invest in building and expanding its factories. From 2017 to 2019, the frequency of factory construction was 2 per year. In recent years, TSMC has continued to expand globally and its factory building activities have become increasingly frequent. From 2020 to 2023, TSMC built 6, 7, 3, and 4 factories respectively.

According to Huang Yuanguo, TSMC plans to build 7 factories this year, including 5 wafer fabs and 2 advanced packaging plants.

In terms of wafer fabs, two 2-nanometer factories located in Hsinchu (Fab20) and Kaohsiung (Fab22), Taiwan, China, will be mass produced in succession next year; Three factories are expected to be built in Arizona, USA, with the first factory expected to start mass production next year, the second factory expected to start mass production in 2028, and the third wafer factory also planned to use 2 nanometers or more advanced processes to produce chips, expected to start production in 2028; In addition, TSMC is also building two wafer fabs in Kumamoto, Japan. One of the fabs is expected to start mass production by the end of this year, while the other is expected to start mass production in 2027.

As for the two advanced packaging plants, Taichung (AP5) and Chiayi (AP7), located in Taiwan, China, China, are expected to provide CoWoS packaging next year, while the latter will mass produce CoWoS and SoIC in 2026.

Huang Yuanguo revealed that TSMC's 3nm production capacity this year will significantly increase by 300% compared to last year, but it is still not enough to meet all the needs of users.

TSMC's advanced process capacity compound annual growth rate from 2020 to 2024 will reach around 25%.

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