Samsung and SK Hynix still maintain a conservative attitude in increasing the production of standard DRAM and NAND chips. It is reported that the contract price of 8Gb DDR4 DRAM universal memory increased by 17% month on month in April, but the price of 128Gb (16Gx8) MLC universal flash memory for portable storage devices such as flash drives remained unchanged.

This is mainly because the earthquake in Taiwan in early April affected Micron's memory production capacity, driving up demand for general-purpose memory in the short term. Overall, the demand for general-purpose storage chips has not truly recovered, and downstream companies still hold a considerable amount of inventory.

On the other hand, the international geopolitical situation is currently in an unstable state. The recent tension in the Middle East region and the additional instability brought by the US election year to global trade have reduced the visibility of demand for general-purpose storage chips due to the interweaving of these two factors.

In addition, under the AI boom, there is a strong demand for HBM memory, and the wafer consumption of HBM is 2-3 times that of general DRAM. Against the backdrop of Samsung Electronics and SK Hynix actively expanding HBM production, the wafer production of General DRAM is bound to be suppressed.

The second half of this year will see the release of heavyweight smartphones such as the Apple iPhone 16 series and Samsung Galaxy Z series. Reports predict that this new wave of smartphones is expected to become an opportunity for manufacturers to increase production of standard storage chips.

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