Armored Xia Xisu Announces the Launch of 218 Layer 3D NAND or Mass Production in 2023

Recently, memory giant Armor and Western Data jointly announced the launch of the latest 218 layer 3D NAND flash memory, showcasing the continuous collaboration and innovation achievements of both parties. According to Masaki Momodomi, the Chief Technology Officer of Armor Xia, the company and Western Digital have successfully launched the eighth generation BiCS flash memory with the highest density in the industry, and have now started providing samples to some customers.

2023-04-04

Samsung plans to invest 200 billion won to produce the third generation semiconductor on an 8-inch wafer

According to reports, Samsung has spent about 200 billion won to begin producing silicon carbide (SiC) and gallium nitride (GaN) semiconductors for power management ICs. It also plans to use 8-inch wafers to produce such chips, skipping the entry-level 6-inch wafer initiated by most power semiconductor manufacturers.

2023-04-01

Semiconductor equipment expenditure is expected to recover to $92 billion in 2024

According to the forecast data released recently by the International Semiconductor Industry Association (SEMI), global wafer factory equipment expenditure in 2023 is expected to decrease by 22% year-on-year to $76 billion, from a record $98 billion in 2022. By 2024, there will be a recovery, with a year-on-year increase of 21% to $92 billion.

2023-03-30

The global flash memory market demand recovers in 2023, and the storage industry may usher in a turnaround

With the development of 5G networks and cloud computing, as well as the popularity of devices such as smartphones, laptops, and game consoles, the global flash memory market demand is expected to recover in 2023. On March 23, Cheng Weihua, Chief Operating Officer of Changjiang Storage, stated that it is expected that global flash memory demand will warm up and supply and demand will balance in 2023.

2023-03-25

Reduced power consumption by 65%! Infineon Launches AirOC Integrated Wi-Fi 5 and Bluetooth Products

Infineon Technology Co., Ltd. recently launched a new AIROC ™ CYW43022 Ultra Low Power Dual Band Wi-Fi 5 and Bluetooth ® "Two in one product, further expanding its existing AIROC Wi-Fi and Bluetooth product portfolio.". The CYW43022 ultra-low power architecture has industry-leading performance, which can reduce power consumption during "deep sleep" by up to 65%, significantly extending the battery life of applications such as intelligent door locks, intelligent wearable devices, IP cameras, and thermostats.

2023-03-22

The yield of Samsung's third-generation 4nm chip will be significantly increased, or mass produced in the first half of this year

According to foreign media reports, Samsung will start mass production of the third generation of 4nm chips in the first half of 2023 in order to regain some lost customers. The report pointed out that Samsung Electronics 4nm had unstable yield at the beginning of its development. Now it has made progress in performance, power consumption and area compared with the original process.

2023-03-14

Organization: The market output value of SiC power components is estimated to exceed US $2.2 billion in 2023

U.S. chipmaker Micron Technology will begin mass production of advanced DRAM memory chips at its Hir...

2023-03-13

Micron to produce 1-beta memory chips in Hiroshima, Japan

U.S. chipmaker Micron Technology will begin mass production of advanced DRAM memory chips at its Hir...

2022-07-18

STBouskoura, Morocco plant opens new production line for electronic components

Global semiconductor leader ST (STMicroelectronics) opened a new electronic component production lin...

2022-07-11

SIA: Tariffs on electronic transmission will hit global semiconductor industry hard

Recently, the Semiconductor Industry Association (SIA) of the United States expressed its views on t...

2022-07-11

Denso considers spinning off its chip business or increasing TSMC's chip production

According to media reports, under the strong demand for automotive chips, Denso Corporation of Japan...

2022-07-11