Hi,welcome
86-755-88844016 6*12 hours online call
Organization: The market output value of SiC power components is estimated to exceed US $2.2 billion in 2023
2023-03-13

The third generation of semiconductors include silicon carbide (SiC) and gallium nitride (GaN), and the overall output value of which is 80% of SiC. SiC is suitable for high-voltage and high-current application scenarios, and can further improve the efficiency of electric vehicles and renewable energy equipment systems. According to the statistics of TrendForce Chibang Consulting Research, with the clarity of the cooperation projects between Ansemi, Infineon and other automotive and energy industries, the overall SiC power component market output value will reach 2.28 billion US dollars in 2023, with an annual growth of 41.4%.


sic_20230310170258_135

The agency said that the top two applications of SiC power components are in the field of electric vehicles and renewable energy, which have reached US $1.09 billion and US $210 million respectively in 2022, accounting for about 67.4% and 13.1% of the overall market output of SiC power components. In terms of vehicle use, Ansemy signed a strategic agreement with Volkswagen (VM) to provide VM with EliteSiC 1200V main inverter power module. In addition, this series of products was also selected by Kia Corporation for EV6 GT vehicles; Wolfspeed and Benz have deepened their cooperation to provide SiC power components for their electric vehicles. In terms of renewable energy, Ansemy also cooperates with Ampt to provide SiC MOSFET required for solar energy and energy storage system optimizer; Infineon's CoolSiC has been introduced into the bidirectional inverter of Delta, which is applied to the three-in-one system of solar power generation, energy storage, and electric vehicle charging. In addition, it has also contributed to the efficiency improvement of Bloom Energy's fuel cell and electrolysis system.

It is reported that the substrate cost accounts for 49% of the silicon carbide power devices, which is also the key to determine the quality of the components. At present, Wolfspeed's silicon carbide substrate market share exceeds 60%, which is the most valued by the market. The attention of global semiconductor manufacturers to the 8-inch silicon carbide substrate is also increasing. Under the leadership of the 8-inch silicon carbide substrate launched by Wolfspeed, other suppliers will keep up and actively carry out upstream and downstream cooperation in the supply chain.

In addition, TrendForce Chibang Consulting also expects that the market output value of SiC power components will reach 5.33 billion US dollars by 2026. Mainstream applications still rely on electric vehicles and renewable energy, with the output value of electric vehicles reaching 3.98 billion US dollars and CAGR of about 38%; Renewable energy reached US $410 million, with a CAGR of about 19%


Prev:STBouskoura, Morocco plant opens new production line for electronic components

Next:The yield of Samsung's third-generation 4nm chip will be significantly increased, or mass produced in the first half of this year

Hot news
SK Hynix plans to adopt 2.5D fanout packaging technology for the next generation HBM
SK Hynix is preparing to launch a 2.5D fanout package as its next-generation storage semiconductor technology. SK Hynix has achieved success in the high bandwidth memory (HBM) field this year and is confident in the next generation chip technology field, seemingly ensuring its technological leadership by developing "professional" memory products. According to South Korean media Business Korea, SK Hynix is preparing to integrate 2.5D fanout packaging technology into its next generation DRAM after HBM.
Mitsubishi Electric collaborates with Anse to develop SiC power semiconductors
Recently, Mitsubishi Electric and Nexperia announced their joint development of efficient silicon carbide (SiC) MOSFET discrete power semiconductors. Mitsubishi Electric will develop and supply SiC MOSFET chips to Nexperia, while Nexperia will develop SiC discrete components equipped with Mitsubishi Electric's chips.
The storage market is deadlocked, and buyers and sellers are engaged in a tug of war
According to reports, the DRAM spot market prices have been in a stalemate recently. Among them, the price of DDR5 16G showed a significant decline in the first half of the past week and then slightly increased, while the price of DDR4 8G remained stable and slightly decreased.
The institution predicts that the annual growth rate of the HBM market will reach 52% in the next four years
Due to the surge in demand for artificial intelligence, the prices and demand for HBM and DDR5 are both increasing. The price of HBM is 5-6 times that of existing DRAM products; The price of DDR5 is also 15% to 20% higher than that of DDR4. From this year to 2027, the annual growth rate of DRAM market revenue is expected to be 21%, while the HBM market is expected to soar by 52%. HBM's share of DRAM market revenue is expected to exceed 10% this year and approach 20% by 2027.
German subsidies or current variables affecting Intel and TSMC's plans to build factories
Recently, a ruling by the Federal Constitutional Court of Germany resulted in the postponement of the country's 2024 federal budget. All government expenditures may be subject to scrutiny, which could result in chip manufacturers such as Intel and TSMC losing significant subsidies.
Botong's $69 billion acquisition of VMWare has been conditionally approved by China
Chip giant Broadcom announced on Tuesday that it plans to complete a $69 billion acquisition of cloud computing company VMWare on Wednesday. The merger between Broadcom and VMware is one of the largest technology industry transactions in history, and although it has been approved by the European Union, the UK, South Korea, and Japan, it still requires approval from China.
TSMC plans to build a third factory in Japan to produce 3-nanometer chips
According to insiders, TSMC is considering building a third chip factory in Japan to produce advanced 3-nanometer chips; This may make Japan an important global chip manufacturing center. Insiders said that the chip foundry has informed supply chain partners that it is considering building a third factory in Kumamoto Prefecture, southern Japan, under the project code TSMC Fab-23 Phase III.
SK Hynix will use its subsidiary's KrF PR for 238 layer NAND flash memory
According to reports, SK Hynix acquired the electronic materials business unit of Jinhu Petrochemical for approximately RMB 2.22 billion in 2020. Recently, according to The Elec, the thick KrF photoresist (PR) developed by SK Hynix has passed the company's quality inspection.
Apple's self-developed 5G modem has been postponed until the end of 2025
The 5G modem project independently developed by Apple has been highly anticipated, but faces new challenges. According to Bloomberg reporter Mark Gurman's latest Power On newsletter, the release time of Apple's self-developed 5G modem may be delayed again, as early as the end of 2025.
TSMC Wins Microsoft 5nm AI Chip Order
According to industry insiders, TSMC has received orders for artificial intelligence (AI) chips from major cloud service providers (CSPs), including Microsoft's 5nm chip order.
User Info：
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message