86-755-88844016 6*12 hours online call
Denso considers spinning off its chip business or increasing TSMC's chip production

According to media reports, under the strong demand for automotive chips, Denso Corporation of Japan (DENSO) is considering splitting its chip business. Since TSMC is its wafer foundry, DENSO is also one of the shareholders of TSMC's Japanese subsidiary JASM, and the two sides have a close cooperation relationship. , As DENSO considers splitting the chip business and expanding the layout of automotive chips, the amount of TSMC's chip production is also expected to increase.

DENSO Chief Technology Officer Yoshifumi Kato revealed in an interview that DENSO must consider whether it is time to sell chips independently. There are also no current plans to raise funds through spin-offs.

Denso considers spinning off its chip business or increasing TSMC's chip production

Semiconductors are playing an increasingly important role in the automotive industry as more and more key components are used in fuel vehicles, electric vehicles and self-driving technologies. DENSO predicts that in 2025, automotive chip demand will be one-third higher than in 2020.

At present, DENSO is the fifth largest automotive chip factory in the world. It has invested about 160 billion yen in the chip business in the past three years, and is actively striving for the throne of the world's leading automotive chip factory.

In order to meet the demand for long-term stable supply of automotive chips, DENSO invested 350 million US dollars in JASM, a subsidiary of TSMC Japan Kumamoto, and obtained more than 10% equity. With the addition of DESNO, JASM also increased the 12/16nm process, and the monthly production capacity increased from 4.5%. 10,000 pieces increased to 55,000 pieces.

At the end of April, Japan's Denso Corporation (DENSO) also said it agreed to cooperate with UMC's 12-inch wafer fab in USJC to produce automotive power semiconductors to meet the growing demand in the automotive market.

It is reported that USJC will install an insulated gate bipolar transistor (IGBT, insulated gate bipolar transistor) production line in the fab, becoming the first fab in Japan to produce IGBTs with 12-inch wafers. DENSO will provide its system-oriented IGBT components and process technology, while USJC will provide 12-inch wafer fab manufacturing capabilities. It is expected to achieve mass production of IGBT processes on 12-inch wafers in the first half of 2023. This collaboration has been supported by Japan's Ministry of Economy, Trade and Industry's Necessity Semiconductor Carbon Reduction and Retrofit Program.

Denso is the largest auto parts maker in Japan and the second largest in the world, and has also established a business in the automotive chip field in recent years. On February 15, 2022, TSMC, Sony Semiconductor Solutions Corporation, and Denso Corporation announced that Denso will acquire a minority stake in Japan Advanced Semiconductor Manufacturing Co., Ltd. (JASM), a subsidiary of TSMC in Kumamoto, Japan, for a $350 million investment. County-owned manufacturing subsidiary.

Hot news
Ruisa Electronics Announces Completion of Panthronics Acquisition to Acquire Its NFC Technology
Recently, Japanese semiconductor solution supplier Reza Electronics announced that it has acquired Panthronics AG, a fabless semiconductor company specializing in high-performance wireless products. At the same time, Reza Electronics has also released 13 "successful product portfolio" solution designs, combining Reza Electronics' products with Pantronics' Near Field Communication (NFC) technology, extending the breadth and depth of Reza Electronics' product lineup.
SK Hynix 5th generation 10 nanometer level DDR5 DRAM development completed
SK Hynix announced that its fifth generation 10 nanometer process, 1bnm, has been validated and will provide support for the next generation DDR5 and HBM3E solutions. The SK Hynix 1bnm process will provide a speed of 6.4 Gbps for DDR5 and 8 Gbps for HBM3E.
Vishay launches a new ISOA thick film power resistor with high pulse processing capability
Recently, Vishay Intertechnology, Inc. announced the launch of a new thick film power resistor - IOA, which has passed AEC-Q200 certification and is packaged in a small SOT-227 package, and can be directly installed on a heat sink. Vishay MCB ISOA has high pulse processing capability, with a power dissipation of up to 120 W at a bottom shell temperature of 85 ° C. It can be equipped with NTC thermistors for internal temperature monitoring, and pre coated with phase change thermal interface materials (PC-TIM) to improve mounting efficiency.
Samsung spends a huge amount of money building semiconductor settlements to attract investment from manufacturers
According to reports, semiconductor giant Samsung Electronics plans to invest 300 trillion Korean won (approximately 1.6 trillion yuan) in the next 20 years to build a new semiconductor manufacturing settlement near Seoul, South Korea. By building facilities nearby and shortening the distance with customers, the delivery time caused by trial and error can be minimized, potentially improving development efficiency.
MediaTek and NVIDIA reached a cooperation to develop AI intelligent cockpit solutions
MediaTek announced a cooperation agreement with NVIDIA to provide a complete AI intelligent cockpit solution for software defined cars. The cooperation between both parties will fully leverage the advantages of their respective automotive product portfolios and jointly provide excellent solutions for the new generation of intelligent vehicles.
DRAM industry Q1 revenue decreased by 21.2% month on month for three consecutive quarters showing a downward trend
According to TrendForce consulting research, the revenue of the DRAM industry in the first quarter of this year was approximately 9.66 billion US dollars, a decrease of 21.2% month on month, and has continued to decline for three more quarters. In terms of shipment volume, only Meiguang has increased, while the rest have declined; The average sales unit price of all three major manufacturers has decreased. At present, due to oversupply but not improvement, prices continue to decline. However, after the original factory gradually reduces production, the price decline of DRAM in the second half of the year is expected to converge quarter by quarter. Looking ahead to the second quarter, although the shipment volume has increased, prices continue to decline, so it is expected that revenue growth will be limited.
News says Samsung Display will use hybrid technology OLED panels for cars
According to reports, Samsung Display, which supplies rigid OLED panels to car manufacturers, has plans to use hybrid technology OLED panels for cars. Hybrid OLED is a new method of applying thin film encapsulation (TFE) to glass substrates. Previously, Samsung monitors had been applying rigid OLEDs to automotive displays.
Q2 performance of applied materials exceeded expectations by 6% compared to the same period last year
Recently, semiconductor equipment giant Applied Materials (AMAT) released its second quarter financial report. The financial report shows that the operating revenue of Applied Materials reached $6.63 billion, a year-on-year increase of 6%. After adjustment, the net profit per share after tax was $2.0, a month on month increase of 8%. The financial performance of the operating conditions exceeded analysts' expectations.
Global semiconductor sales decreased by 8.7% to $119.5 billion in Q1 2023
Recently, WSTS released the latest data showing that global semiconductor sales in the first quarter of 2023 were $119.5 billion, a decrease of 8.7% month on month and 21.3% year on year. This is the largest quarterly and year-on-year decrease since the first quarter of 2019. In addition, Intel defeated Samsung to regain the top spot in the global semiconductor industry.
Texas Instruments TI Launches Silicon Carbide Gate Driver
Texas Instruments (TI) today launched a highly integrated functional safety compliant isolated gate driver, helping engineers design more efficient traction inverters and extend the range of electric vehicles (EVs) to a greater extent. The new UCC5880-Q1 enhanced isolated gate driver provides functionality that enables electric vehicle powertrain engineers to achieve their safety and performance goals while increasing power density, reducing system design complexity and cost.
User Info:
Phone number
  • +86
  • +886
  • +852
Company Name
Product model
Comment message