Hi,welcome
86-755-88844016 +852 2632 9637 6*12 hours online call
Armored Xia Xisu Announces the Launch of 218 Layer 3D NAND or Mass Production in 2023
2023-04-04

Recently, memory giant Armor and Western Data jointly announced the launch of the latest 218 layer 3D NAND flash memory, showcasing the continuous collaboration and innovation achievements of both parties. According to Masaki Momodomi, the Chief Technology Officer of Armor Xia, the company and Western Digital have successfully launched the eighth generation BiCS flash memory with the highest density in the industry, and have now started providing samples to some customers.


Alper Ilkbahar, Senior Vice President of Technology and Strategy at Western Data Corporation, said, "The new 3D flash memory technology demonstrates our strong collaboration with Armor and our position in technological innovation. By adhering to a common innovation research and development path and continuing to invest in research and development, we have been able to commercialize this fundamental technology in advance and provide high-performance, cost-effective solutions


Masaki Momodomi, Chief Technology Officer of Armored Knight Company, stated: Based on our unique cooperative relationship in the field of technology engineering, we have successfully launched the eighth generation BiCS flash memory with the highest density in the industry. We have now started providing samples to some customers. Through the application of CBA and scaling technology innovation, we have made further progress in the combination of 3D flash memory technology, which can support a series of data-centric application scenarios including smartphones, IoT devices, and data centers


The 218 layer 3D flash memory technology launched by Western Data in collaboration with Armor Xia utilizes 1Tb TLC (third level unit) and QLC (fourth level unit) with four planes, and adopts innovative lateral shrinkage technology, increasing bit density by about 50%. Its NAND I/O speed exceeds 3.2Gb/s, which is about 60% higher than the previous generation product, while improving write performance and read latency by about 20%, providing users with higher performance and availability.


ICGOO (92)_20230403180330_185


About Western Data Company


Western Data has always been committed to exploring the value of data and creating more possibilities. With the integration and accumulation in the fields of flash memory and HDD, as well as the promotion and development of memory technology, Western Data continues to break through and innovate, continuously launching powerful data storage solutions to support the ambitious process of global digital future. At the same time, Western Data regards sustainable development as its core value, deeply understands the urgency of addressing climate change, and actively achieves the ambitious carbon reduction goals of the Science Based Targets Initiative (SBTi).


About the Armor Hero


Armor is a global leader in storage solutions, dedicated to the development, production, and sales of flash and solid-state drives (SSDs). In 1987, Toshiba invented NAND flash memory. In April 2017, the predecessor of Armor, Toshiba Memory, was spun off from Toshiba Corporation. Armor Hero is committed to enhancing the world with storage, providing products, services, and systems that can create choices for users while also creating storage based value for society. Armored Xia's Innovative 3D Flash Technology BiCS FLASH ™, We are shaping many future storage methods for high-density applications, including advanced smartphones, PCs, SSDs, automobiles, and data centers.

Hot news
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
Samsung Electronics has basically completed the development of the 8nm version of eMRAM memory process upgrade
Samsung Electronics representative stated at the AI-PIM seminar in South Korea that they are gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed. As a new type of memory, MRAM is based on the principle of magnetism and has non-volatile properties. It does not need to constantly refresh data like DRAM memory, making it more energy-efficient and efficient; At the same time, the write speed of MRAM is 1000 times that of NAND, supporting applications that require higher write rates.
From January to April, the production of integrated circuits increased by 37.2% year-on-year, reaching 135.4 billion blocks
Recently, the official website of the Ministry of Industry and Information Technology showed that from January to April, China's electronic information manufacturing industry saw steady growth in production, export recovery improved, efficiency continued to improve, investment maintained rapid growth, and the overall growth trend of the industry was significant.
The NAND Flash market saw growth in the first quarter of 2024
According to TrendForce consulting research, due to the widespread use of enterprise SSDs in artificial intelligence servers starting in February 2024, as well as PC and smartphone manufacturers continuing to increase inventory to combat price increases, NAND Flash revenue increased by 28.1% month on month in the first quarter of 2024, reaching $14.71 billion.
TSMC predicts that the AI accelerator market may grow by 250%
According to information disclosed by TSMC at its technology seminar, the semiconductor market only began to recover in the second half of last year, so analysts are cautious about this year's growth. Although the growth expectations for the PC and smartphone sectors are only in single digits this year, there is one semiconductor market expected to grow by about 250%, which is the AI accelerator market.
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message