TSMC launches N4e special process to increase production capacity by 50%

TSMC announced at the 2024 European Technology Forum that it plans to expand its special process capacity by 50% in the future and enhance the resilience of its semiconductor supply chain.

2024-05-22

Microchip launches new radiation resistant 32-bit microcontroller SAMD21RT

Space exploration is entering a period of revival, with a series of exciting new missions unfolding one after another, such as the highly anticipated Artemis II (Artemis II program), the successful landing of JAXA SLIM and Chandararian-3 on the moon, and the new deployment of New Space in low Earth orbit (LEO). Designers need electronic components that meet strict radiation and reliability standards to meet the requirements for working in harsh space environments. Microchip Technology announced the launch of a new radiation resistant 32-bit microcontroller, SAMD21RT. This product is based on Radiation Resistant (RT) Arm ® Cortex ®- M0+technology, using 64 pin ceramic and plastic packaging, with 128 KB flash memory and 16 KB SRAM.

2024-05-20

Micron Memory Meets New Progress

Research firm TrendForce Consulting held an AI server forum on the 17th. According to Micron, they have been preparing for DDR5 technology for a long time, and HBM's production capacity has reached full capacity before 2025. Micron has multiple layouts in various storage products and provides strong support for AI data centers.

2024-05-20

TSMC's CoWoS production capacity is still in short supply

Research institutions point out that it is expected that TSMC's monthly CoWoS production capacity will reach 40000 pieces by 2024 and further double by the end of next year. However, with the launch of Nvidia B100 and B200 chips, the production capacity of TSMC's CoWoS continues to be in short supply due to an increase in silicon interlayer area and a decrease in the number of 12 inch wafers cut out.

2024-05-20

An increase in HBM production capacity may help stabilize the upward trend of DRAM prices

Due to the time needed for the recovery of demand for PCs and smartphones, the price increase of DRAM used for temporary data storage on smartphones, PCs, and data center servers has come to a halt. In April 2024, the wholesale price of the indicator product DDR4 8Gb (bulk trading price) was around $1.95 per unit, while the price of smaller 4Gb products was around $1.50 per unit. The prices remained unchanged from the previous month (March 2024) and remained unchanged for the second consecutive month. As of February 2024, DRAM prices have shown an upward trend for four consecutive months. The wholesale price of DRAM is determined monthly or quarterly between storage vendors and customers.

2024-05-20

Bourns launches TLVR1005T and TLVR1105T series multiphase cross inductor voltage regulators

Bain Bourns, a globally renowned supplier of power, protection, and sensing solutions for electronic components, has launched the new TLVR1005T and TLVR1105T series multiphase cross inductor voltage regulators (TLVR) inductors. It has great current capability, low inductance, and low DC resistance (DCR), aiming to meet the performance requirements of today's data-driven applications. This type of application is constantly evolving in terms of processing performance and requires support for power bead inductors that can match their abnormally high current specifications within the same or even smaller board space. Bourns ® The TLVR1005T and TLVR1105T series multiphase TLVR inductors meet the requirements of servers, workstations, data centers, storage systems, desktop computers, display adapters, and various battery powered systems.

2024-05-20

TSMC's 3nm process is on track, and N3P nodes will be put into operation as scheduled in the second half of 2024

TSMC recently held a technical seminar, stating that its 3nm process node has entered the right track, and the N3P node will be put into mass production in the second half of 2024.

2024-05-20

Rapidus collaborates with Esperanto to develop low-power AI chips

Rapidus, a Japanese wafer foundry startup, announced a memorandum of understanding with Esperanto, an American RISC-V architecture chip design company. The two sides will collaborate on the research and development of artificial intelligence (AI) semiconductors for data centers, jointly developing low-power AI chips.

2024-05-18

Honda Motor et IBM concluent un partenariat pour développer conjointement des technologies automobiles intelligentes

Honda Motor Corporation et IBM ont récemment annoncé la signature d'un protocole d'accord qui permettra de collaborer à la recherche et au développement de technologies intelligentes telles que les puces et les logiciels pour les voitures du futur.

2024-05-18

News reports that Samsung HBM3E chip has not passed NVIDIA verification

Memory giants Micron, SK Hynix, and Samsung sent samples of eight layer vertically stacked 24GB HBM3E to NVIDIA at the end of July, mid August, and early October 2023. Micron and SK Hynix HBM3E passed NVIDIA validation and received orders in early 2023, but Samsung HBM3E did not pass validation.

2024-05-18

SK Hynix will produce Power Management (PMIC) chips for Tesla

​According to reports, SK Key Foundry, a contract manufacturing subsidiary of SK Hynix, plans to produce power management chips (PMICs) installed on Tesla electric vehicles as early as July at the 8-inch wafer factory in Cheongju, Chungcheongbuk do.

2024-05-16

Sharp plans to sell semiconductor business

Recently, Japanese panel giant Sharp released its financial report, which showed a net loss of 152 billion yen in the previous quarter due to recognized impairment losses in its panel business. Sharp announced that the 10th generation panel factory (SDP) in Tujie City, which produces large-sized LCD panels for television, will cease production before the end of September, while production of small and medium-sized LCD panels will be reduced and consideration will be given to selling the camera module business and semiconductor business units such as sensors.

2024-05-16

NAND Flash Price Increase Storage Factory Armor Hero Turns Loss into Profit

Original Armor Xia released its fourth quarter (January March 2024) financial report, showing a 31% increase in revenue from last year to 322.1 billion yen, marking the first growth in seven quarters; The net profit was 10.3 billion yen, the first profit in six quarters, and a loss of 130.9 billion yen in the same period last year.

2024-05-16

Intel is about to complete financing deal to raise $11 billion for Irish wafer fabs

The report states that Intel is close to reaching a financing agreement with asset management company Apollo, and the Intel Ireland wafer plant is expected to receive $11 billion in construction funds.

2024-05-15

Institutional forecast: Global IC sales are expected to soar by 21% in the second quarter of 2024

The latest report from SEMI International Semiconductor Industry Association shows that with the increase in sales in the electronics sector, stable inventory, and increased wafer fab production capacity, there are signs of improvement in the global semiconductor manufacturing industry in the first quarter of 2024, and it is expected that industry growth will become stronger in the second half of the year.

2024-05-15

Samsung Electronics Adjusting Strategy: Future Storage Business Focus Shifts to Enterprise Sector

Recently, media reports have reported that Samsung Electronics stated in its latest earnings conference call that the focus of its future storage business will no longer be on consumer grade PCs and mobile devices, but on enterprise areas such as HBM, DDR5 server memory, and enterprise level SSDs.

2024-05-15

SK Hynix plans to launch HBM4E in 2026 with a memory bandwidth 1.4 times that of the previous generation

Kim Gwi wook, head of HBM at SK Hynix, stated that the industry's HBM technology has reached a new level, and industry demand has prompted SK Hynix to accelerate the development process. The earliest release of HBM4E memory is in 2026, and the related memory bandwidth will be 1.4 times that of HBM4.

2024-05-14

Intel appoints new head of chip foundry business

Intel announced the appointment of Kevin O'Buckley as the head of its chip foundry business services division.

2024-05-14

Arm will develop AI chips and predict mass production in the fall of 2025

Arm, a global IP leader under SoftBank Group, announced the establishment of a dedicated AI chip department, with plans to develop AI chip prototype products before the spring of 2025. Large scale production will be undertaken by contract manufacturers, and the first batch of mass production is expected to begin in the autumn of 2025.

2024-05-13

Micron Technology announces shipment of key memory products for AI data centers

Recently, Micron Technology announced that it is the first in the industry to verify and ship 128GB DDR5 RDIMM memory based on a large capacity 32Gb single DRAM chip, with a speed of up to 5600MT/s on all mainstream server platforms.

2024-05-11