Apple's self-developed 5G modem has been postponed until the end of 2025

The 5G modem project independently developed by Apple has been highly anticipated, but faces new challenges. According to Bloomberg reporter Mark Gurman's latest Power On newsletter, the release time of Apple's self-developed 5G modem may be delayed again, as early as the end of 2025.

2023-11-20

TSMC Wins Microsoft 5nm AI Chip Order

According to industry insiders, TSMC has received orders for artificial intelligence (AI) chips from major cloud service providers (CSPs), including Microsoft's 5nm chip order.

2023-11-18

Samsung plans to launch 3D AI chip packaging "SAINT" in 2024

As semiconductor microfabrication processes approach the physical limit, advanced packaging technology has become the focus of competition. TSMC is the first to launch the 3Dfabric platform, and Samsung plans to launch the "SAINT" advanced 3D chip packaging technology to catch up.

2023-11-17

Samsung and SK Hynix Q3 semiconductor inventories remain at high levels

The semiconductor libraries of Samsung and SK Hynix also maintained a high level in the third quarter of 2023. According to Samsung's quarterly report, as of the third quarter of 2023, its overall inventory amount was 55.2 trillion won, an increase of 5.9% from 52.1 trillion won at the end of 2022; The inventory amount of semiconductors has significantly increased by 16.1% from 29 trillion won at the end of 2022 to 33.7 trillion won, an increase of more than twice compared to the end of 2021.

2023-11-16

SK Hynix HBM's shipment volume is expected to increase significantly, reaching 100 million by 2030

SK Hynix CEO Jeong ho Park revealed in his speech on the 13th that the company's high bandwidth memory (HBM) shipment this year is 500000 units, and it is expected to reach 100 million units per year by 2030.

2023-11-15

Advanced process competition among wafer foundry giants entering white-hot stage

The advanced process investment of wafer foundry giants stems from the explosion of demand in the chip market. With the promotion of emerging technologies such as AI and high-performance computing, the importance of advanced manufacturing processes in the wafer foundry industry has become increasingly prominent, attracting wafer foundry companies such as TSMC, Samsung, and Intel to accelerate the introduction of more advanced manufacturing technologies to meet the continuous growth of market demand.

2023-11-14

Samsung Releases 2.1D Semiconductor Packaging Technology Cost May Reduce by 22%

Samsung has recently introduced the next generation (2.3D) semiconductor packaging technology to strengthen its competition with Intel and TSMC, which can be used to package high-performance semiconductors such as AI chips. It is reported that this packaging technology can reduce costs by 22% without sacrificing performance.

2023-11-13

Bosch, Infineon, and NXP have been approved by Germany to invest in TSMC chip factories

Recently, the German antitrust agency announced approval for Bosch, Infineon, and NXP to invest in TSMC's German Dresden 12 inch chip factory.

2023-11-11

Reza Electronics Releases Next Generation MCU Chips and Roadmap

Reza Electronics, a global semiconductor solution provider, recently unveiled its next generation System on Chip (SoC) and Microcontroller (MCU) plans for all major applications in the automotive industry. As of now, the average annual shipment volume of all Ruisa MCUs in recent years has exceeded 3.5 billion, of which about 50% is used in the automotive industry, while the rest is used in industries, the Internet of Things, data centers, and communication infrastructure.

2023-11-10

News says Intel has decided to shelve Vietnam's investment plan

Currently, Vietnam has Intel's largest chip assembly, packaging, and testing factory. In February of this year, it was revealed that Intel plans to add $1 billion worth of investment in Vietnam to enhance its chip cluster effect in Vietnam. However, the latest news indicates that Intel has shelved its new investment plan in Vietnam.

2023-11-09

Samsung Electronics plans to invest 700-1 trillion won to expand HBM production capacity

Samsung Electronics has acquired some buildings and equipment within the Tian'an factory area of Samsung Display to expand HBM production capacity. Samsung Electronics plans to establish a new packaging line at the Tianan factory for large-scale production of HBM. The company has spent 10.5 billion Korean won to purchase the aforementioned buildings and equipment, and is expected to invest an additional 700 billion to 1 trillion Korean won.

2023-11-08

TI announces the official start of construction for the second 12 inch wafer factory located in Utah

Recently, Texas Instruments (TI) announced that it is breaking ground on its second 300mm semiconductor wafer factory located in Lehi, Utah. After completion, TI's two factories in Utah will produce tens of millions of analog and embedded processing chips at full capacity every day.

2023-11-07

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2023-11-07

TDK Launches First SMD Impact Current Limiter

The J404 developed by TDK Corporation is the first surface mounted surge current limiter (ICL) based on PTC (Positive Temperature Coefficient) technology. This component (order number B59404J0170A062) is designed specifically for applications with DC voltages up to 500 V and AC voltages up to 350 V, and can be used to limit surge currents in applications such as DC buses and charging equipment in electric vehicles.

2023-11-04

Ansemy's automotive business revenue in the third quarter reached $1.2 billion, a year-on-year increase of 33%

Ansemy announced its third quarter results for the 2023 fiscal year: revenue for the third quarter was $2.1808 billion, GAAP and non GAAP gross profit margin were 47.3%, GAAP operating profit margin and non GAAP operating profit margin were 31.5% and 32.6%, respectively, GAAP diluted earnings per share were $1.29, and non GAAP diluted earnings per share were $1.39. Among them, the automotive business revenue set a record, increasing by 33% year-on-year to $1.2 billion.

2023-11-03

Samsung Electronics Q3 Profits Decline 78%, Storage Market Expected to Revive Next Year

Recently, Samsung Electronics released its Q3 financial report for 2023, with sales of 67.4047 trillion won, a year-on-year decrease of 12.21%; Net income decreased by 40% to 5.5 trillion won; The operating profit was 2.4336 trillion won, a year-on-year decrease of 77.57%; The current net profit was 5.8441 trillion won, a decrease of 37.76%.

2023-11-02

Li Jidian and SBI plan to build a factory in Miyagi, Japan, expected to be put into operation in 2026

Taiwan, China's semiconductor manufacturing giant, "Power Crystal Manufacturing" (PSMC), is negotiating with Japan's SBI Holdings to build a semiconductor factory in Miyagi Prefecture. The first phase of the factory will invest approximately 400 billion yen, with the goal of being put into operation by 2026.

2023-11-01

SK Hercules opposes, new variables arise in the merger plan between Western and Armored Knights

The merger plan between NAND flash memory chip manufacturer Kioxia and Western Data (WD) is currently facing new variables. SK Hynix stated on Thursday that it does not agree to the merger between Japan's Kioxia and Western Data in the United States, and there is more uncertainty in transactions between Japanese and American storage chip companies.

2023-10-31

SK Hynix HBM3E chip in short supply and production capacity has been fully booked for next year

HBM is a new type of memory that shortens the communication distance between memory and processors by vertically stacking DRM chips. Simply put, HBM can provide high bandwidth, allowing for more efficient data transmission between CPU and GPU, as well as between memory and storage.

2023-10-30

Samsung is in talks with customers regarding cooperation in 2nm and 1.4nm processes

Although Samsung Electronics produced its 3-nanometer OEM business earlier than TSMC, it has fallen behind TSMC due to the loss of major customers such as Qualcomm and NVIDIA.

2023-10-27