Recently, Micron Technology announced that it is the first in the industry to verify and ship 128GB DDR5 RDIMM memory based on a large capacity 32Gb single DRAM chip, with a speed of up to 5600MT/s on all mainstream server platforms.

It is reported that the 128GB DDR5 RDIMM memory adopts Micron's industry-leading 1 β (1-beta) process technology, compared to competitors using 3DS silicon via (TSV) technology, increases capacity density by more than 45%, improves energy efficiency by up to 22%, and reduces latency by up to 16%.

This high-speed memory module is specifically designed for common task critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in memory databases (IMDB), and scenarios that require efficient processing of multi-threaded, multi-core general-purpose computing workloads, to meet their performance requirements.

It is reported that Micron's 128GB DDR5 RDIMM memory module has received strong ecological support from many companies, including AMD, HPE, Intel, Supermicro, and others. Praveen Vaidyanathan, Vice President and General Manager of the Computing Products Business Group at Micron, stated that currently, AI servers can be equipped with Micron's 24GB8 layer stacked HBM3E as GPU additional memory, and Micron's 128GB RDIMM as CPU additional memory, providing the high-capacity, high bandwidth, and low-power infrastructure required for memory intensive workloads.

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