Hi,welcome
86-755-88844016 +852 2632 9637 6*12 hours online call
Bourns launches TLVR1005T and TLVR1105T series multiphase cross inductor voltage regulators
2024-05-20

Bain Bourns, a globally renowned supplier of power, protection, and sensing solutions for electronic components, has launched the new TLVR1005T and TLVR1105T series multiphase cross inductor voltage regulators (TLVR) inductors. It has great current capability, low inductance, and low DC resistance (DCR), aiming to meet the performance requirements of today's data-driven applications. This type of application is constantly evolving in terms of processing performance and requires support for power bead inductors that can match their abnormally high current specifications within the same or even smaller board space. Bourns ® The TLVR1005T and TLVR1105T series multiphase TLVR inductors meet the requirements of servers, workstations, data centers, storage systems, desktop computers, display adapters, and various battery powered systems.


Bourns_20240517152054_520

Bourns ® TLVR1005T and TLVR1105T series multiphase cross inductor voltage regulator (TLVR) inductors


Traditional multiphase voltage regulators (VR) have issues with balancing performance, as high current output requires a longer single-phase stage to increase the duty cycle of previous processing. The all-new multiphase TLVR architecture is widely adopted to address transient response issues caused by sudden increases in load output. Therefore, system designers have seen the advantage of phase coupling in the TLVR architecture, which can achieve extremely fast transient response and can be extended according to CPU, FPGA, and ASIC load requirements. Adopting this architecture enables designers to develop powerful systems without sacrificing other key design parameters such as circuit board space, system efficiency, power density, or BOM cost.


Bourns ® The TLVR1005T and TLVR1105T series adopt a dual winding structure and clamp coil design, providing the required low inductance and extremely high current carrying capacity (Irms up to 77 A and Isat up to 160 A), meeting the needs of the new generation of multiphase power solutions. This series of products adopts a shielding structure with low radiation characteristics, an inductance range of 70 to 200 nH, and a working temperature range of -40 to+125 º C.


The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!

Prev:TSMC's 3nm process is on track, and N3P nodes will be put into operation as scheduled in the second half of 2024

Next:An increase in HBM production capacity may help stabilize the upward trend of DRAM prices

Hot news
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
Samsung Electronics has basically completed the development of the 8nm version of eMRAM memory process upgrade
Samsung Electronics representative stated at the AI-PIM seminar in South Korea that they are gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed. As a new type of memory, MRAM is based on the principle of magnetism and has non-volatile properties. It does not need to constantly refresh data like DRAM memory, making it more energy-efficient and efficient; At the same time, the write speed of MRAM is 1000 times that of NAND, supporting applications that require higher write rates.
From January to April, the production of integrated circuits increased by 37.2% year-on-year, reaching 135.4 billion blocks
Recently, the official website of the Ministry of Industry and Information Technology showed that from January to April, China's electronic information manufacturing industry saw steady growth in production, export recovery improved, efficiency continued to improve, investment maintained rapid growth, and the overall growth trend of the industry was significant.
The NAND Flash market saw growth in the first quarter of 2024
According to TrendForce consulting research, due to the widespread use of enterprise SSDs in artificial intelligence servers starting in February 2024, as well as PC and smartphone manufacturers continuing to increase inventory to combat price increases, NAND Flash revenue increased by 28.1% month on month in the first quarter of 2024, reaching $14.71 billion.
TSMC predicts that the AI accelerator market may grow by 250%
According to information disclosed by TSMC at its technology seminar, the semiconductor market only began to recover in the second half of last year, so analysts are cautious about this year's growth. Although the growth expectations for the PC and smartphone sectors are only in single digits this year, there is one semiconductor market expected to grow by about 250%, which is the AI accelerator market.
User Info：
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message