In the first four months, China's exports of integrated circuits increased by 23.5% year-on-year

On May 9th, the General Administration of Customs released data showing that in the first four months of 2024, China's total import and export value of goods trade (hereinafter referred to as the same) was RMB 13.81 trillion, a year-on-year increase of 5.7%. Among them, exports reached 7.81 trillion yuan, an increase of 4.9%; Imports reached 6 trillion yuan, an increase of 6.8%; The trade surplus was 1.81 trillion yuan, narrowing by 0.7%. In US dollars, the total import and export value of China in the first four months was 1.94 trillion US dollars, an increase of 2.2%. Among them, exports reached 1.1 trillion US dollars, an increase of 1.5%; Imports reached 843.91 billion US dollars, an increase of 3.2%; The trade surplus was $255.66 billion, narrowing by 3.9%.

2024-05-10

Gexin Q1 revenue of $1.549 billion, net profit down 47%

Semiconductor foundry company GlobalFoundries, formerly known as Grofond, recently released its first quarter financial report. Gexin achieved a revenue of $1.549 billion (currently approximately RMB 11.184 billion) in the previous quarter, a decrease of 16% compared to the previous quarter and the same period last year. Its net profit was $134 million, a decrease of 47% compared to the same period last year.

2024-05-09

Innovation breakthrough! 600 ℃ high temperature resistant memory has emerged

Recently, scientists at the University of Pennsylvania in the United States have developed a memory that can work continuously for 60 hours at a high temperature of 600 ℃. This temperature tolerance is more than twice that of current commercial storage devices, indicating that the memory has extremely strong reliability and stability, and is expected to excel in extreme environments that can cause electronic or storage device failures. It also lays the foundation for artificial intelligence systems that perform intensive computing under harsh conditions.

2024-05-07

Samsung Electronics and Zeiss Collaborate to Strengthen Focus on EUV Technology and Semiconductor Equipment

Samsung Electronics is deepening its cooperation with Zeiss Group in next-generation EUV and chip technology. Zeiss Group is the only optical system supplier for ASML Holding NV, the world's only supplier of extreme ultraviolet (EUV) optical systems.

2024-04-30

TSMC announces that the A16 1.6nm process is expected to be mass-produced in 2026

Recently, TSMC held the "2024 TSMC North America Technology Forum" in the United States, revealing its latest process technology, advanced packaging technology, and three-dimensional integrated circuit (3D IC) technology, using this leading semiconductor technology to drive innovation in the next generation of artificial intelligence (AI).

2024-04-26

Samsung Electronics to Expand Silicon Valley R&D Institutions to Specially Design AI Chips

Samsung Electronics plans to expand its research and development (R&D) facility in Silicon Valley, focusing on artificial intelligence (AI) chip design. In the process of reshaping the semiconductor industry with a focus on artificial intelligence chips, Samsung aims to strengthen its design capabilities to break the current market landscape dominated by large technology companies such as Nvidia in the United States.

2024-04-20

Storage chip prices rise, module manufacturers are unwilling to follow up

Recently, storage chip manufacturers have been insisting on raising prices, but module manufacturers have refused to purchase and are unwilling to accept price increases. According to insiders, the demand for enterprise storage and cloud data centers has remained strong, but customers in the consumer market find it difficult to bear the significant price increase.

2024-04-17

In Q3 2023, the top 10 global semiconductor equipment manufacturers achieved revenue exceeding $25 billion, a month on month increase of 3%

According to CINNO Research statistics, the total revenue of the global semiconductor equipment manufacturer market in the third quarter of 2023 exceeded 25 billion US dollars, a year-on-year decrease of 9% and a month on month increase of 3%.

2023-12-19

Li Jidian plans to build a factory in Japan to promote its automotive chip business

The head of Power Semiconductor Manufacturing (PSMC) recently stated that the company will use its new factory in Japan as a springboard to significantly expand its automotive semiconductor business. "Japan has huge opportunities," said Huang Chongren, CEO of Li Jidian, in a media interview. Japan has a broad market prospect and a geographical advantage where many car companies gather.

2023-12-15

Samsung's low-priced challenge to TSMC's 2nm battle begins

According to insiders, TSMC has demonstrated the process testing results of N2 (i.e. 2 nanometers) prototypes to its major customers such as Apple and Nvidia. Samsung is also actively launching a 2-nanometer prototype and adopting a low-cost strategy to attract customers such as Nvidia.

2023-12-13

Nikon launches a new ArF immersion lithography machine, which is 30% cheaper in price

Recently, Nikon announced that it will officially launch the ArF 193 nano immersion lithography machine "NSR-S636E" in January 2024, which will further improve production efficiency and etching accuracy. It is reported that Nikon's exposure machine adopts an enhanced iAS design, which can be used for high-precision measurement, circular warping, and distortion correction. The overlap accuracy (MMO) is higher, claiming to not exceed 2.1 nanometers.

2023-12-12

Intel's appeal wins $2.18 billion compensation judgment overturned

The Federal Circuit Court of Appeals in the United States has announced the overturning of a 2021 ruling by a Texas court jury, which found Intel to be liable for $2.18 billion in compensation to patent technology company VLSI for patent infringement. This is one of the largest rulings in US patent history. The appellate court held that Intel's infringement of one patent involving $675 million in compensation does not constitute infringement, while the infringement of the other patent involving $1.5 billion in compensation remains valid, but the amount of compensation needs to be reconsidered by the Texas court.

2023-12-08

Spend 5 billion euros! STMicroelectronics will build a new SiC wafer factory

Recently, STMicroelectronics has decided to further expand its production facilities by establishing a brand new silicon carbide (SiC) semiconductor wafer fab in Catane, Sicily, Italy. The total investment amount is up to 5 billion euros, and the wafer factory will specialize in producing silicon carbide chips, which are key technologies for electric vehicles and have strong growth potential.

2023-12-06

AMD plans to establish the world's largest design center in India

AMD announced the opening of its largest global design center, AMD Technostar, in Bangalore, India. This move is also part of AMD's global expansion, aimed at enhancing its competitiveness in the fiercely competitive semiconductor market.

2023-12-05

Apple may abandon independent research and development of 5G modem chips

Supply chain sources have revealed that Apple may decide to stop developing its self-developed 5G modem chip after multiple failed attempts to improve it.

2023-12-04

Samsung Electronics CIS products have seen a maximum price increase of 30%

After a long period of downturn, the consumer electronics industry has finally ushered in the dawn of recovery. Recently, media reports have reported that Samsung Electronics has issued a CIS price increase notice to customers, with an average increase of up to 25% in the first quarter of next year, and some products have seen the highest increase of up to 30%. The price increase mainly focuses on products with specifications above 32 million pixels.

2023-12-01

Samsung suspends NAND flash memory shipments, Q4 storage chip contract price exceeds expectations

Although most terminal products have had mediocre sales during recent promotional periods, the spot prices of storage chips are still showing an upward trend despite significant production cuts and production control by Samsung, SK Hynix, and Micron. Among them, due to more severe losses, the increase in NAND storage chips is more significant.

2023-12-01

SK Hynix plans to adopt 2.5D fanout packaging technology for the next generation HBM

SK Hynix is preparing to launch a 2.5D fanout package as its next-generation storage semiconductor technology. SK Hynix has achieved success in the high bandwidth memory (HBM) field this year and is confident in the next generation chip technology field, seemingly ensuring its technological leadership by developing "professional" memory products. According to South Korean media Business Korea, SK Hynix is preparing to integrate 2.5D fanout packaging technology into its next generation DRAM after HBM.

2023-11-29

Mitsubishi Electric collaborates with Anse to develop SiC power semiconductors

Recently, Mitsubishi Electric and Nexperia announced their joint development of efficient silicon carbide (SiC) MOSFET discrete power semiconductors. Mitsubishi Electric will develop and supply SiC MOSFET chips to Nexperia, while Nexperia will develop SiC discrete components equipped with Mitsubishi Electric's chips.

2023-11-28

The storage market is deadlocked, and buyers and sellers are engaged in a tug of war

According to reports, the DRAM spot market prices have been in a stalemate recently. Among them, the price of DDR5 16G showed a significant decline in the first half of the past week and then slightly increased, while the price of DDR4 8G remained stable and slightly decreased.

2023-11-27