Memory giants Micron, SK Hynix, and Samsung sent samples of eight layer vertically stacked 24GB HBM3E to NVIDIA at the end of July, mid August, and early October 2023. Micron and SK Hynix HBM3E passed NVIDIA validation and received orders in early 2023, but Samsung HBM3E did not pass validation.
TSMC not only provides advanced AI GPU OEM to Nvidia, but also is responsible for CoWoS advanced packaging between AI GPUs and HBM memory, making it an important participant in Nvidia's verification and audit process.
A source familiar with the supply relationship between Samsung Electronics and Nvidia told Korean media that the verification process of Samsung Electronics 8Hi HBM3E is stuck in the approval process of TSMC.
The source claimed that the main reason Samsung's products failed the test was that TSMC used the testing standards based on SK Hynix HBM3E products during testing.
Samsung's Q1 2024 financial report stated that the eight layer vertically stacked HBM3E will be in mass production in April, and 12 layers of vertically stacked HBM3E will be produced in the second quarter, ahead of the original plan for the second half of the year. Samsung said it is accelerating the production progress of the new HBM to meet the growing demand for generative AI applications.
Industry insiders have revealed that if the testing standards are adjusted accordingly, it will not be a problem for Samsung's HBM3E to pass NVIDIA's verification process.
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