According to SK Hynix regulatory documents, customer deposits increased significantly again in the first quarter of 2024. SK Hynix stated that it received a prepayment of 56.1 billion Korean won and customer liabilities (customer deposits) of 2.7459 trillion Korean won.

Customer prepayments increased by 1.16 trillion Korean won (approximately 850 million US dollars) compared to the previous quarter. The previous quarter's customer prepayments were 1.58 trillion Korean won, an increase of 1.3 trillion Korean won from the third quarter of last year, indicating another win for HBM in this quarter.

SK Hynix has stated that HBM production capacity has been sold out this year, and production capacity has also been basically sold out in 2025. The company has received advance payments from its main customer Nvidia for expanding HBM3E production capacity in the second half of 2023.

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Therefore, Nvidia is likely to continue making payments to ensure a stable supply of HBM chips.

Meanwhile, Samsung announced that it will begin mass production of HBM3E 8H DRAM this month, and HBM3E 12H will also begin mass production in the second quarter. These chips are expected to be used for AMD's MI350 chip.

SK Hynix plans to accelerate the supply cycle of new HBM DRAM products from 2 years to 1 year. The 6th generation (HBM4) and 7th generation (HBM4E) are expected to complete technology development and mass production in 2025 and 2026.

HBM4 will increase data processing capacity from 24-36GB to 48GB by stacking 16 layers. The application of hybrid bonding in the large-scale production process of HBM still has yield issues, so the "Advanced MR-MUF" method will be adopted.

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