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High-power semiconductor refrigeration sheet TEC1-12715

TEC1-12715

Model:TEC1-12715

Manufacturer:ANSC/OEM

Size:40*40*4.0mm±0.2 Component log: 127

Assembly pressure:85N/cm2

Working current:Imax=11.8A (Maximum voltage 15.5V 15A at start-up)

Storage conditions:-40~60℃

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Product Description

 High-power semiconductor refrigeration sheet TEC1-12715


Chip type:TEC1-12715
Size:40*40*3.2mm±0.2 Component log:127
wire:Tin plating on 200±8mm RV standard conductor with 5 mm lead length
Internal resistance:0.8~0.9Ω(ambient temperature 23±1℃, 1kHZ Ac test)
TD MAX:above 62℃
Working current:Imax=11.8A (Maximum voltage 15.5V 15A at start-up)
Rated voltage:DC12V(Vmax:15.5V)
Refrigeration power:142W (excessive heat dissipation surface temperature will reduce cooling power)
Assembly pressure:85N/cm2
Working environment:Temperature range-55℃~83℃(excessive ambient temperature drop directly affects refrigeration efficiency)
Packaging process:Surrounding Standard 704 Silicone Rubber Seal
Packaging standards:Foam box packaging, storage conditions, ambient temperature-10℃~40℃
Storage conditions:-40~60℃
Power requirements:Single voltage 12V, current 15A or more working power supply (can be used in series and parallel)
Device characteristics:Red wire positive, black wire negative (with literal for refrigeration surface, no literal for heat dissipation surface)

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