Hi,welcome
86-755-88844016 6*12 hours online call
What is the appropriate temperature for SMD welding? SMD components and their welding techniques
2023-04-13

Chip welding is one of the most important processes in electronic product manufacturing, and temperature is one of the most important parameters in chip welding. The correct welding temperature can ensure the safe and reliable welding of SMD components, and improve the quality and reliability of electronic products. If you want to gain a deeper understanding of patch welding, this article will summarize relevant knowledge and provide you with a comprehensive understanding and understanding.


SMD components and their welding techniques


SMD component: SMD component is a small electronic component, usually made of plastic or ceramic, and its surface is usually coated with solder or other welding materials. SMD components include resistors, capacitors, inductors, diodes, etc.


Welding technology: Welding technology refers to the technology of welding SMD components and circuit boards together. Welding techniques include manual welding, machine welding, and laser welding. Among them, manual welding is the most common welding technique, usually using soldering iron for welding.


Suitable temperature for patch welding


When welding SMD components, welding temperature is a very important parameter. Low welding temperature may cause the SMD components to not be securely soldered, while high welding temperature may cause damage to the SMD components or circuit boards.


Generally speaking, the welding temperature should be controlled between 200-250 ° C to ensure the safe and reliable welding of SMD components. During the welding process, the appropriate welding temperature should be determined based on the material and welding requirements of the SMD components.


ICGOO (75)_20230412174351_477


When welding SMD components, it is also necessary to pay attention to the following items:


Before welding, it is necessary to clean the circuit board and SMD components to ensure welding quality and reliability.


When welding, it is necessary to control the welding time. Excessive welding time may cause damage to the SMD components or circuit boards.


After welding, it is necessary to check the welding quality and strength of the solder joints. If any welding defects or insufficient solder joint strength are found, they need to be repaired or replaced in a timely manner.


The correct welding temperature and welding technology are important factors to ensure the safe and reliable welding of SMD components. In the manufacturing of electronic products, it is necessary to determine the appropriate welding temperature and time based on specific welding requirements and component materials to ensure welding quality and reliability.

Hot news
AUO
TFT-LCD modules, TFT-LCD panels, energy storage/management systems, touch solutions, etc.
The working principle and classification of electromagnetic voltage transformers
Electromagnetic voltage transformers are commonly used in power systems to measure voltage on high-voltage transmission lines. They can also be used to monitor the voltage waveform and amplitude in the power system, in order to timely detect faults and problems in the power system. In this article, we will provide a detailed introduction to the working principle and classification of electromagnetic voltage transformers.
Differences between thermal relays and thermal overload relays
Thermal relays and thermal overload relays are common electrical protection devices, but their working principles and protection objects are different. In this article, we will provide a detailed introduction to the differences between thermal relays and thermal overload relays.
Types and Packaging of Tantalum Capacitors
Tantalum capacitors are electronic components that use tantalum metal as the electrode material. They are usually divided into two types: polarized and unpolarized, and come in various packaging forms. In this article, we will discuss in detail the types and packaging of tantalum capacitors.
The difference between thermal relays and fuses
Thermal relays and fuses are common electrical components that play a protective role in circuits. Although they can both interrupt the circuit, there are some differences between them. In this article, we will provide a detailed introduction to the differences between thermal relays and fuses.
FT2232 Development Board
A development board designed with FT2232 chip, which fully leads out the IO port, can be used to design an interface expansion board based on this.
AI high-performance computing - integrated storage and computing
Integrated storage and computing or in memory computing is the complete integration of storage and computing, directly utilizing memory for data processing or computation. Under the traditional von Neumann architecture, data storage and computation are separated. Due to the increasing performance gap between storage and computation, the speed at which the processor accesses stored data is much lower than the processor's computation speed. The energy consumption of data transportation between memory and main memory is also much higher than the energy consumed by the processor's computation.
AI High Performance Computing - Google TPU
Since Google launched the first generation self-developed artificial intelligence chip Tensor Processing Unit (TPU) in 2016, it has been upgraded to the fourth generation TPU v4 after several years of development (as of the end of 2022). The TPU architecture design also achieves efficient computation of network layers such as deep learning convolutional layer and fully connected layer by efficiently parallelizing a large number of multiplication and accumulation operations.
AI High Performance Computing - Cambrian NPU
The Cambrian period was one of the earliest AI chip companies in China to study. The design of their AI chip NPU (Neural Network Processing Unit) originated from a series of early AI chip architecture studies, mainly including DianNao, DaDianNao, PuDianNao, ShiDianNao, Cambricon-X, and other research achievements.
AI High Performance Computing - AI Chip Design
The simplest and most direct design approach for AI chips is to directly map neurons to hardware chips, as shown in the figure. The Full Hardware Implementation scheme maps each neuron to a logical computing unit and each synapse to a data storage unit. This architecture design can achieve a high-performance and low-power AI chip, such as an Intel ETANN chip. In the full hardware implementation scheme, the output data of the previous layer is multiplied by the weight, and the results of the multiplication are then added up, and then output to the next layer for calculation through an activation function. This architecture design tightly couples computing and storage, allowing the chip to avoid large-scale data access while performing high-speed computing, improving overall computing performance while also reducing power consumption.
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message