Product Descriptions

DDR3L SDRAM (1.35V) is a low voltage version of theDDR3 (1.5V)SDRAM.Referto the DDR3 (1.5V) SDRAM data sheet specifications when running in 1.5V compatible mode.

Product Features

• VDD = VDDQ = 1.35V (1.283–1.45V)

• Backward compatible to VDD = VDDQ = 1.5V ±0.075V

– Supports DDR3L devices to be backward compatible in 1.5V applications

• Differentialbidirectionaldatastrobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CKB)

• 8 internalbanks

• Nominal and dynamic on-die termination (ODT) for data,strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• TC of 0°C to + 95°C

– 64ms, 8192-cycle refresh at 0°C to +85°C

– 32ms at +85°C to +95°C

• Self refresh temperature (SRT)

• Automatic self refresh (ASR)

• Writeleveling

• Multipurposeregister

• Outputdrivercalibration

Options

• Configuration

– 512 Meg x 8

– 256 Meg x 16

• FBGA package (Pb-free) – x8

– 78-ball (10.6mm x 7.5mm)

• FBGA package (Pb-free) – x16

– 96-ball (13.5mm x 7.5mm)

• Timing – cycle time

– 938ps @ CL = 14 (DDR3-2133)

– 1.07ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

• Operating temperature

– Commercial (0°C ≤TC ≤ +95°C)

  Specifications

Actual product photos

Product Data Book：

For more product information, please download the PDF

Payment&Transportation

Official Certificate&Certificate

Multiple product supply

Company office environment

Warehouse Real Shot

Standard packaging

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