Product Descriptions

Combining Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4 family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. 

Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC® processors (with a 

new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4 FPGA building blocks are 

enhancements of those found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, and Virtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on a state-of-the-art 90 nm copper process 

using 300 mm (12-inch) wafer technology

Product Features

• Three Families — LX/SX/FX

- Virtex-4 LX: High-performance logic applications solution

- Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications

- Virtex-4 FX: High-performance, full-featured solution for embedded platform applications

• Xesium™ Clock Technology

- Digital clock manager (DCM) blocks

- Additional phase-matched clock dividers (PMCD)

- Differential global clocks

• XtremeDSP™ Slice 

- 18 x 18, two’s complement, signed Multiplier

- Optional pipeline stages

- Built-in Accumulator (48-bit) and Adder/Subtracter

• Smart RAM Memory Hierarchy

- Distributed RAM

- Dual-port 18-Kbit RAM blocks

· Optional pipeline stages

· Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals

- High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.

• SelectIO™ Technology

- 1.5V to 3.3V I/O operation

- Built-in ChipSync™ source-synchronous technology

- Digitally controlled impedance (DCI) active termination

- Fine grained I/O banking (configuration in one bank)

• Flexible Logic Resources

• Secure Chip AES Bitstream Encryption

• 90 nm Copper CMOS Process

• 1.2V Core Voltage

• Flip-Chip Packaging including Pb-Free Package Choices

• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]

• IBM PowerPC RISC Processor Core [FX only]

- PowerPC 405 (PPC405) Core

- Auxiliary Processor Unit Interface (User Coprocessor)

• Multiple Tri-Mode Ethernet MACs [FX only]

Specifications

Actual product photos

Product Data Book：

For more product information, please download the PDF

Payment&Transportation

Official Certificate&Certificate

Multiple product supply

Company office environment

Warehouse Real Shot

Standard packaging

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