Product Features
embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard
SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard
- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,
Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200
- Non-supported Features : Large Sector Size (4KB)
Additional feature : HS400 mode (200MHz DDR - up to 400Mbps)
Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)
Data bus width : 1bit (Default), 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C)
Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)
Specifications
| Attribute | Attribute value |
| Model | ANSC-M24082073 |
| Product Name | KLMAG2GEND-B031 |
| ECCN (US) | 3A991.b.1.a |
| Part Status | Obsolete |
| Automotive | No |
| PPAP | No |
| Cell Type | MLC NAND |
| Chip Density (bit) | 128G |
| Architecture | Sectored |
| Boot Block | Yes |
| Number of Bits/Word (bit) | 36989 |
| Number of Words | 128G/32G/16G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Maximum Erase Time (S) | 0.02 |
| Interface Type | Serial e-MMC |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Maximum Operating Frequency (MHz) | 200 |
| Typical Operating Supply Voltage (V) | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Temperature (°C) | 85 |
| Command Compatible | Yes |
| ECC Support | Yes |
| Support of Page Mode | No |
| Packaging | Tape and Reel|Tray |
| Mounting | Surface Mount |
| Package Height | 0.48 |
| Package Width | 11.5 |
| Package Length | 13 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 153 |
| Lead Shape | Ball |
Actual product photos
Product Data Manual:
For more product information, please download the PDF
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Standard packaging
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