Product Details
Transistor
DPAK for Surface Mount
N-Channel Enhancement-Mode Silicon Gate
This advanced high–cell density HDTMOS E–FET is designed to with stand high energy in the avalanche and commutation modes. The new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for low–voltage, high–speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits, and inductive loads. The avalanche energy capability is specified to eliminate the guess work in designs where inductive loads are switched, and to offer additional safety margin against unexpected voltage transients.
• Avalanche Energy Specified
• Source–to–Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSSand VDS(on)Specified at Elevated Temperature
• Surface Mount Package Available in 16 mm, 13–inch/2500 Unit Tape & Reel, Add T4 Suffix to Part Number
• Available in Insertion Mount, Add –1 or 1 to Part Number
Product Description
Type | Description |
ANSC PART# | MTD20P06HDL |
Manufacturer | ONSEMI |
Package Description | DPAK-3 |
Pin Count | 3 |
Factory Lead Time | 4 Weeks |
Additional Feature | ULTRA LOW RESISTANCE, LOGIC LEVEL COMPATIBLE, AVALANCHE RATED |
Avalanche Energy Rating (Eas) | 300 mJ |
Case Connection | DRAIN |
Configuration | SINGLE WITH BUILT-IN DIODE |
DS Breakdown Voltage-Min | 60 V |
Drain Current-Max (ID) | 15 A |
Drain-source On Resistance-Max | 0.175 Ω |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Moisture Sensitivity Level | 1 |
Number of Elements | 1 |
Number of Terminals | 2 |
Operating Mode | ENHANCEMENT MODE |
Operating Temperature-Max | 150 °C |
Operating Temperature-Min | -55 °C |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE |
Peak Reflow Temperature (Cel) | 235 |
Polarity/Channel Type | P-CHANNEL |
Power Dissipation-Max (Abs) | 74 W |
Pulsed Drain Current-Max (IDM) | 45 A |
Qualification Status | Not Qualified |
Surface Mount | YES |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | GULL WING |
Terminal Position | SINGLE |
Time@Peak Reflow Temperature-Max (s) | 30 |
Transistor Application | SWITCHING |
Transistor Element Material | SILICON |
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Product datasheet
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