Product Descriptions

Combining Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4 family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC® processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4 FPGA building blocks are enhancements of those found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, and Virtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.

Product Features

• Three Families — LX/SX/FX 

- Virtex-4 LX: High-performance logic applications solution 

- Virtex-4 SX: High-performance solution for digital signal  processing (DSP) applications 

- Virtex-4 FX: High-performance, full-featured solution for  embedded platform applications 

• Xesium™ Clock Technology 

- Digital clock manager (DCM) blocks 

- Additional phase-matched clock dividers (PMCD) 

- Differential global clocks 

• XtremeDSP™ Slice  

- 18 x 18, two’s complement, signed Multiplier 

- Optional pipeline stages 

- Built-in Accumulator (48-bit) and Adder/Subtracter 

• Smart RAM Memory Hierarchy 

- Distributed RAM 

- Dual-port 18-Kbit RAM blocks 

· Optional pipeline stages 

· Optional programmable FIFO logic automatically  remaps RAM signals as FIFO signals 

- High-speed memory interface supports DDR and DDR-2  SDRAM, QDR-II, and RLDRAM-II.

• SelectIO™ Technology 

- 1.5V to 3.3V I/O operation 

- Built-in ChipSync™ source-synchronous technology 

- Digitally controlled impedance (DCI) active termination 

- Fine grained I/O banking (configuration in one bank) 

• Flexible Logic Resources 

• Secure Chip AES Bitstream Encryption 

• 90 nm Copper CMOS Process 

• 1.2V Core Voltage 

• Flip-Chip Packaging including Pb-Free Package  Choices 

• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit  Transceiver (MGT) [FX only] 

• IBM PowerPC RISC Processor Core [FX only] 

- PowerPC 405 (PPC405) Core 

- Auxiliary Processor Unit Interface (User Coprocessor) 

• Multiple Tri-Mode Ethernet MACs [FX only]

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