Hi,welcome
86-755-88844016 +852 2632 9637 6*12 hours online call
What does packaging material mean? Integrated circuit chip packaging process
2022-07-11

Packaging materials refer to glass, ceramics, silicon, RTV, nickel, gold, aluminum, etc. used in the manufacture of sensors. Electronic packaging materials refer to the electronic packaging materials used to carry electronic components and their interconnection, provide mechanical support, seal environmental protection, and disperse It is a matrix material with good electrical insulation and is the sealing body of an integrated circuit. The chip is the core of many electronic devices. In order to improve your understanding of the chip, this article will introduce the integrated circuit chip packaging process. In order to help you understand more deeply, the following contents are arranged for your reference.

A chip is an integrated circuit composed of a large number of transistors. Different chips have different integration scales, ranging from hundreds of millions to hundreds of millions; from tens to hundreds of transistors. A transistor has two states: on and off, denoted by 1.0. Multiple 1s and 0s generated by multiple transistors are set to specific functions (i.e. instructions and data) to represent or process letters, numbers, colors and graphics. After the chip is powered on, a startup command is first generated to start the chip, and then new commands and data are continuously accepted to complete the function.

What does packaging material mean? Integrated circuit chip packaging process

Overview of Integrated Circuit Chip Packaging

Packaging concept:

1. Narrow sense: using membrane technology and micromachining technology to arrange elements such as chips on a frame or substrate. Paste and fix the connection, lead out the terminal, and seal and fix it through a plastic insulating medium to form an overall three-dimensional structure.

2. In a broad sense: the package body and the substrate are connected and fixed, and assembled into a complete system or electronic equipment to ensure the comprehensive performance of the entire system.

The function of the chip package:

1. Transmission function; 2. Transmission circuit signal; 3. Provide heat dissipation; 4. Structural protection and support.

Packaging engineering technology level:

Packaging engineering starts with the pasting, fixing, interconnection, packaging, sealing protection, connection with circuit boards, system combination of integrated circuit chips until the final product is completed.

The first layer: also known as chip layer packaging, refers to the pasting and fixing between the integrated circuit chip and the packaging substrate or lead frame. The circuit connection and packaging protection process make it a modular (component) assembly that is easy to pick and place for transportation and can be connected to the next level of assembly.

Second Layer: The process of combining several first-layer completed packages with other electronic components to form a circuit card.

Layer 3: Combining several of the packaged assembled circuit cards completed on the second layer into a component or subsystem on the main circuit board.

Fourth layer: The process of assembling several subsystems into a complete electronic product.

The connection process between integrated circuit components on a chip is also called zero-level packaging, so packaging engineering can also be divided into five levels.

Packaging classification:

1. According to the packaging quantity of IC chips: single-chip packaging (scp) and multi-chip packaging (MCP);

2. According to the sealing material: polymer material (plastic) and ceramic;

3. According to the interconnection between the device and the circuit board: pin insertion type (PTH) and surface mount type (SMT) 4. According to the pin distribution form: single-sided pins, double-sided pins, four-sided pins and bottom pin;

SMT devices have L-type.J-type.I-type metal pins.

SIP: Single-Line Package SQP: Small Package MCP: Metal Can Package DIP: Dual-Line Package CSP: Chip Size Package QFP: Quad Flat Package PGA: Dot Matrix Package BGA: Ball Grid Array Package LCC: Leadless Ceramic Chip Carrier.


Hot news
What are the main characteristics of optoelectronic devices
Optoelectronic devices, as an important component of modern technology, are increasingly widely used in fields such as communication, energy, and detection. The main characteristics of optoelectronic devices are the foundation of their functions and applications. This article will explore these characteristics in detail and explain their applications in modern technology.
SLKOR
Brand: SLKORintroductionSLKOR is a power component design, production and sales company - the comp...
Smalite
Brand: SmaliteintroductionFocus on the R&D, production and sales of LED optoelectronic product...
AUO
TFT-LCD modules, TFT-LCD panels, energy storage/management systems, touch solutions, etc.
The working principle and classification of electromagnetic voltage transformers
Electromagnetic voltage transformers are commonly used in power systems to measure voltage on high-voltage transmission lines. They can also be used to monitor the voltage waveform and amplitude in the power system, in order to timely detect faults and problems in the power system. In this article, we will provide a detailed introduction to the working principle and classification of electromagnetic voltage transformers.
Differences between thermal relays and thermal overload relays
Thermal relays and thermal overload relays are common electrical protection devices, but their working principles and protection objects are different. In this article, we will provide a detailed introduction to the differences between thermal relays and thermal overload relays.
Types and Packaging of Tantalum Capacitors
Tantalum capacitors are electronic components that use tantalum metal as the electrode material. They are usually divided into two types: polarized and unpolarized, and come in various packaging forms. In this article, we will discuss in detail the types and packaging of tantalum capacitors.
The difference between thermal relays and fuses
Thermal relays and fuses are common electrical components that play a protective role in circuits. Although they can both interrupt the circuit, there are some differences between them. In this article, we will provide a detailed introduction to the differences between thermal relays and fuses.
FT2232 Development Board
A development board designed with FT2232 chip, which fully leads out the IO port, can be used to design an interface expansion board based on this.
AI high-performance computing - integrated storage and computing
Integrated storage and computing or in memory computing is the complete integration of storage and computing, directly utilizing memory for data processing or computation. Under the traditional von Neumann architecture, data storage and computation are separated. Due to the increasing performance gap between storage and computation, the speed at which the processor accesses stored data is much lower than the processor's computation speed. The energy consumption of data transportation between memory and main memory is also much higher than the energy consumed by the processor's computation.
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message