MCM=MultiChip Module

A MultiChip Module (MCM) is a type of electronic packaging technology that involves the integration of multiple integrated circuits (ICs) on a single substrate or package. MCMs typically include two or more ICs, each with its own specific function, which are mounted on a common substrate and interconnected using advanced packaging techniques such as wire bonding or flip-chip bonding. MCMs are often used in high- performance applications where size, weight, and power consumption are critical factors. By integrating multiple ICs on a single package, MCMs can offer significant advantage in terms of size reduction, improved performance, and reduced power consumption compared to traditional packaging methods. Examples of applications that use MCMs include microprocessors, memory modules, and communication systems.