Samsung Electronics may mass produce 2nm in 2025 and expand to automotive chips in 2027_News_ALL NEW SEMI (ANSC)

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Samsung Electronics may mass produce 2nm in 2025 and expand to automotive chips in 2027

2023-07-03

Samsung Electronics is one of the world's leading chip manufacturing companies and is currently strengthening its competitiveness in the field of chip foundry. Recently, the company has released a clear roadmap with plans to capture more market share in the coming years.

Samsung Electronics recently held the "2023 Samsung Foundry model forum" in Silicon Valley, California, USA, and released the cutting-edge Foundry model process roadmap aimed at the era of artificial intelligence.

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Cui Shirong, President of the OEM Business Unit, stated that many cooperative enterprises are actively developing generative AI specific semiconductors, and Samsung Electronics will also upgrade the new GAA · Gate All Around transistor technology to meet the needs and technological trends of the AI market, promoting AI technology innovation. Cui Shirong emphasized that he will continue to collaborate with partners to develop cutting-edge semiconductor technologies, making semiconductor technologies such as chips more diverse and accelerating the arrival of the "post Moore era".

Samsung Electronics achieved mass production of 3-nanometer process semiconductor products based on Full Surrounding Gate (GAA) technology in June last year. The company has previously announced that it will mass produce 2nm process semiconductors based on GAA technology from 2025. On the same day, it proposed a specific timetable, that is, from 2025 to 2025, it will focus on mobile terminals, apply 2nm process to high-performance Computer cluster (HPC) by 2026, and expand its use to automotive chips by 2027.

At the same time, the company also decided to provide high-performance and low power consumption GaN power semiconductor Foundry model services required by AI technology from 2025. To this end, the company will establish an advanced packaging negotiation mechanism "MDI (Multi Die Integration) Alliance" with relevant enterprises.

Samsung Electronics stated that through these measures, the company aims to increase its semiconductor production capacity to 7.3 times that of 2021 by 2027.

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