The Ministry of Industry and Information Technology, the Ministry of Education, the Ministry of Science and Technology, the Ministry of Finance, and the State Administration for Market Regulation recently jointly issued the "Implementation Opinions on Improving the Reliability of the Manufacturing Industry", proposing to focus on key industries such as machinery, electronics, and automobiles, benchmark the advanced level of similar international products, supplement the reliability shortcomings of basic products, and improve the reliability level of complete equipment, focusing on the strategic goal of building a strong manufacturing and quality country, Strengthen the team of reliability professionals and form a group of manufacturing enterprises with high product reliability, strong market competitiveness, and significant brand influence.
By 2025, the reliability level of key core products in key industries will significantly improve, the reliability standard system will be basically established, the quality and reliability management capabilities of enterprises will continue to enhance, the reliability testing and verification capabilities will be significantly improved, and the professional talent team will continue to grow. Build three or more reliability common technology research and development service platforms, form more than 100 typical demonstration models for reliability improvement, and promote more than 1000 enterprises to implement reliability improvement.
By 2030, the reliability level of 10 key core products will reach international advanced levels, and the leading role of reliability standards will be fully demonstrated. By cultivating a group of reliability public service institutions and reliability professionals, the overall reliability level of China's manufacturing industry will reach a new level, becoming an important engine to support the high-quality development of the manufacturing industry.
Specifically, in the electronics industry, the focus will be on improving high-end general-purpose chips such as SoC/MCU/GPU for electronic equipment, wide bandgap semiconductor power devices such as gallium nitride/silicon carbide, precision optical components, optical communication devices, new sensitive components and sensors, high adaptability sensor modules, Beidou chips and devices, chip resistance capacitance sensing components, high-speed connectors, high-end RF devices, high-end electromechanical components, etc The reliability level of electronic components such as LED chips. Improve the performance of electronic materials such as high-frequency and high-speed printed circuit boards and substrates, new display specific materials, high-efficiency photovoltaic cell materials, lithium battery key materials, electronic pastes, electronic resins, electronic chemicals, new display electronic functional materials, advanced ceramic substrate materials, electronic assembly materials, chip advanced packaging materials, etc., improve the packaging and curing of components, uniform epitaxy, defect control and other process levels, strengthen material analysis Research and development of destructive physical analysis, reliability test analysis, board level reliability analysis, failure analysis and other analysis and evaluation technologies, as well as the construction of standard systems, to promote their application in relevant industries.
The overall equipment and system level will focus on improving intelligent products such as drones, virtual reality/augmented reality (VR/AR) devices, service robots, intelligent door locks, electronic specialized equipment such as exposure machines, plating machines, slicers, coating machines, electronic measuring instruments such as mass spectrometers, oscilloscopes, electronic lenses, high-efficiency photovoltaic cells, Internet of Things terminals such as Beidou navigation terminals and 5G communication devices, high-end servers, laser printers The reliability level of computers and external equipment such as remote conference systems.