Hi,welcome
+86 135 5637 6665 +852 2632 9637 6*12 hours online call
Eastern High Tech Expands SiC and GaN Research and Development
2023-10-25

In order to support future business growth, East High Tech, a South Korean wafer foundry, is increasing its research and development efforts in the fields of silicon carbide (SiC) and gallium nitride (GaN) semiconductors. The recent investment aims to enhance its manufacturing capacity for 8-inch wafers.


Due to the slow market recovery, the operation of the 8-inch wafer factory in this generation of factories is expected to be affected, while the issue of switching to the operation of the 12-inch wafer factory still exists. In this situation, the future development of Eastern High Tech will focus on new power semiconductors such as GaN and SiC.

搜狗高速浏览器截图20231025131156


Compared with silicon (Si) semiconductors, silicon carbide (SiC) and gallium nitride (GaN) based power semiconductors have faster power conversion efficiency and excellent durability.


Eastern High Tech was established in 1997, also known as DB HiTek. Semiconductor products such as microcontroller units (MCU), display driver chips (DDI), and image sensors (CIS) designed for global fabless customers. Especially in the production of Si DDI, MCU, CIS.


Around May this year, the company successfully spun off its chip design department and became a pure wafer foundry. DB Global Chip plans to expand its factory free business from liquid crystal display (LCD) DDI to organic light emitting diodes (OLEDs) and Mini LED DDI, headquartered in Banqiao, Gyeonggi do. DB HITECH will become a pure semiconductor commissioned production (OEM) enterprise.


The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!

Hot news
Differences in the Performance of LED Core Technologies
The core performance indicators of LED devices are mainly reflected in the following six aspects
PCB wiring principles and techniques
1、 Manually wiring as much as possible
Mikroe Motion 2 Click Board Product Introduction
Mikroe Motion 2 Click is based on the Panasonic EKMC1607112 PIR motion sensor and is used as a human motion detector
SK Hynix develops a new generation of mobile NAND flash memory solutions
As the industry's highest-performance product, it will begin mass production in the third quarter of this year and be integrated into edge-side AI smartphones
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message