SK Hynix CEO Jeong ho Park revealed in his speech on the 13th that the company's high bandwidth memory (HBM) shipment this year is 500000 units, and it is expected to reach 100 million units per year by 2030.

Yesterday afternoon, after the end of the Shared Growth Council Golf Championships held in Gyeonggi do's Gyeongju East Valley CC, Park Chung ho delivered the aforementioned speech in his speech.

The Shared Growth Council is a supplier group for SK hynix. This golf tournament was organized and initiated by SK hynix's procurement department, with over 100 participants including supplier representatives.

Park Chung ho shared HBM's business performance and future prospects at this golf tournament. He told the supplier representative, "Due to the decrease in equipment investment, it will be difficult overall, but we will overcome the difficulties together. He also emphasized that the company plans to start producing semiconductors at the Longren cluster factory as planned in 2027.

At the third quarter financial report conference call at the end of last month, SK hynix stated its plan to increase facility investment next year on top of this year. However, the company explained that as demand has not yet fully recovered, the scope of investment expansion will be limited and the focus will be on HBM.

The company stated that investment in silicon direct voltage electrodes (TSV) for the production and stacking of 1b process DRAM on the next generation HBM3E is considered top priority.

The market is optimistic about SK Hynix's return to profitability in the fourth quarter. Analysts believe that due to strong sales of high-end memory such as HBM, the speed of turning losses into profits will be faster than expected. However, Park Chung ho also cautioned against being overly optimistic about economic recovery and investment expansion, believing that "there is a high possibility of a deterioration in the US economy next year

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