The semiconductor packaging material market may recover in the second half of 2023_News_ALL NEW SEMI (ANSC)

Hi,welcome

The semiconductor packaging material market may recover in the second half of 2023

2023-04-19

Recently, TECHCET released its latest outlook for the semiconductor packaging material market, which is expected to total approximately $26.1 billion in 2022 and reach $30 billion by 2027.

Due to the expected slowdown in the entire semiconductor industry, packaging materials are expected to decline by approximately 0.6%. However, in the second half of 2023, the market is expected to recover and achieve growth in 2024, resulting in a 5% increase in revenue for the year.

半导体材料_20230418155118_415

TECHCET stated that since 2020, packaging materials have experienced strong shipments and revenue growth. The changes in end market demand, coupled with tight supply chains and logistics constraints, have led to an increase in material prices throughout the entire supply chain. In addition, many material departments are limited in terms of available production capacity. Due to the pressure of rising costs, many suppliers have restricted investment related to production capacity. The supply chain and logistics limit the speed at which suppliers can expand their production capacity.

The upward trend in packaging material prices has completely reversed the price reduction trend of over a decade, largely due to pressure from equipment manufacturers and OSAT. Reducing costs has become a catchphrase for limiting material suppliers' investment in production capacity. These demand driven price increases have driven packaging material revenue growth of over 15% in 2020 and over 20% in 2021. As long as raw material and energy costs continue to remain high and suppliers remain cautious in their capacity expansion plans, current prices are expected to remain unchanged.

In addition, wafer level packaging, flip chip packaging, and heterogeneous integration are the main driving forces for the development of the new materials field. The biggest application of wafer level packaging is still mobile electronics, but other application scenarios, such as the automotive industry, are also growing rapidly. Flip chip interconnection is still showing strong growth in high-performance computing, high-frequency communication, and other applications, with the increasing use of copper pillar interconnection technology.

Hot news

Renesa Electronics collaborates with Meibei Sanmei to develop an angle sensor stepper motor control scheme

Ruisa Electronics Co., Ltd., a leading global semiconductor solution supplier, and Meibei Sanmei Co., Ltd., a leading global stepper motor supplier, have announced the joint development of stepper motor and motor control solutions based on rotary transformers (angle sensors), and have been optimized for machinery, office automation (OA) equipment, and medical/nursing equipment. The stepper motor and motor control solution based on rotary transformer sensors jointly developed by Ruisa Electronics and Meibei Sanmei can meet the needs of higher precision control, miniaturization, and stronger resistance to environmental impacts of motors.

It is reported that TSMC has collaborated with Broadcom, Nvidia, and others to develop silicon photonic technology

According to the news, TSMC has collaborated with major clients such as Broadcom and Nvidia to develop new products such as silicon photonic technology and co packaging optical components. The process technology has been extended from 45nm to 7nm, with large orders starting from the second half of next year at the earliest. It is expected to enter the stage of large-scale production by 2025.

Intel Announces a New OEM Agreement with Gaota Semiconductor

Recently, Intel Foundry Services (IFS) announced a new OEM agreement with Tower Semiconductor, an Israeli semiconductor foundry.

Vishay Launches Industry Advanced Standard Rectifier and TVS Two in One Solution

The space saving device adopts a small FlatPAK 5 x 6 package, with built-in 3 A, 600 V standard rectifier and 200 W TRANSZORB ® TVS

Automotive chip race track is hot, TSMC and Samsung actively layout

With the rapid growth of demand for electric vehicles and autonomous vehicle, the market demand for advanced high-performance semiconductor products is also surging. The growth of this demand has prompted the semiconductor industry to shift from traditional mature processes to more advanced processes, making the competition for advanced processes in automotive electronics more intense.

STMicroelectronics Announces Mass Production of PowerGaN Devices

STMicroelectronics announced that it has started mass production of enhanced mode PowerGaN HEMT (High-electron-mobility transistor) devices that can simplify the design of efficient power conversion systems. STPOWER ™ GaN transistors have improved the performance of wall power adapters, chargers, lighting systems, industrial power supplies, renewable energy generation, automotive electrification, and other applications.

Infineon Expands Production to Build the World's Largest 8-inch SiC Wafer Factory

Recently, power semiconductor giant Infineon announced plans to invest up to 5 billion euros in the next five years to build the world's largest 8-inch SiC power wafer factory in Malaysia.

Infineon High Voltage Superjunction MOSFET Series Products Add Industrial Grade and Vehicle Gauge Grade Devices

In static switching applications, power supply design focuses on minimizing conduction losses, optimizing thermal performance, achieving compact and lightweight system design, while achieving high quality at low cost. In order to meet the needs of new generation solutions, Infineon Technologies Technology Co., Ltd. is expanding its CoolMOS ™ The product lineup of S7 series high-voltage superjunction (SJ) MOSFETs. This series of devices are mainly applicable to applications such as switching power supply (SMPS), solar energy system, battery protection, Solid-state relay (SSR), motor starter and solid state circuit breaker, as well as Programmable logic controller (PLC), lighting control, high-voltage electronic fuse/electronic circuit breaker and (hybrid) electric vehicle on-board charger.

AMD plans to invest approximately $400 million in expanding the Indian market within five years

Recently, AMD announced that it will invest approximately $400 million in expanding in India over the next five years. This major decision will have a positive impact on the Indian Semiconductor industry, and it is also a strategic step for AMD to expand its global business.

ST STMicroelectronics Q2 revenue growth 12.7%, auto business growth for four consecutive quarters

STMicroelectronics held the financial statement explanation meeting for the second quarter of 2023. Data shows that STMicroelectronics's net income in the second quarter was 4.33 billion US dollars, up 12.7% year on year. Gross margin is 49%, operating profit margin is 26.5%, and net profit is $1 billion; In the first half of the year, the net income was US $8.57 billion, up 16.1% year on year, the Gross margin was 49.3%, and the net profit was US $2.05 billion. Jean Marc Chery, president of STMicroelectronics, said that the net income in the second quarter increased by 12.7% year on year, mainly due to the continuous strong growth of automobile and industrial businesses.