Hi,welcome
+86 135 5637 6665 +852 2632 9637 6*12 hours online call
Meiguang will invest 4.3 billion yuan to expand Xi'an Sealing and Testing Plant
2023-06-19

Micron Technology announced today that it plans to invest more than 4.3 billion yuan in its packaging and testing plant in Xi'an, China, in the next few years.


The investment plan includes the company's decision to acquire the packaging equipment of Licheng Semiconductor (Xi'an) Co., Ltd. (Licheng Xi'an), as well as plans to build a new factory in Meiguang Xi'an and introduce new and high-performance packaging and testing equipment to better meet the needs of Chinese customers.

未标题-1

Micron Technology said: "This investment adheres to the concept of Meguiar's global packaging and testing, and will enhance the flexibility of the company's manufacturing of multiple product portfolios in Xi'an, so that Meguiar can directly operate its packaging and testing business in the Xi'an factory." The new factory announced this time will introduce new production lines for manufacturing mobile DRAM, NAND and SSD products, to strengthen the existing packaging and testing capabilities of the Xi'an factory. Meiguang has been preparing for this project for some time and has initiated qualification certification for the production of mobile DRAM in Xi'an.


According to the long-term strategic agreement reached earlier, Licheng Xi'an's equipment has been operating in Meiguang's wholly-owned factory since 2016. The agreement has currently expired. Meiguang expects this acquisition project to be completed within approximately one year and requires approval from Chinese regulatory authorities.


Meiguang will provide new employment contracts to all 1200 employees in Licheng Xi'an. The new investment project will also add an additional 500 job opportunities, bringing the total number of Meiguang employees in China to over 4500.

Hot news
Differences in the Performance of LED Core Technologies
The core performance indicators of LED devices are mainly reflected in the following six aspects
PCB wiring principles and techniques
1、 Manually wiring as much as possible
Mikroe Motion 2 Click Board Product Introduction
Mikroe Motion 2 Click is based on the Panasonic EKMC1607112 PIR motion sensor and is used as a human motion detector
SK Hynix develops a new generation of mobile NAND flash memory solutions
As the industry's highest-performance product, it will begin mass production in the third quarter of this year and be integrated into edge-side AI smartphones
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message