Hi,welcome
+86 135 5637 6665 +852 2632 9637 6*12 hours online call
Infineon Announces ModusToolbox Launch ™ three point one
2023-06-20

With software becoming a key feature of various embedded solutions in today's products, embedded developers must acquire and use appropriate software tools to bring these products to the market, such as being able to provide flexible development tools and supporting the best platform from the entry-level to the final hardware deployment in terms of features and functions. Infineon Technologies Technology Co., Ltd. recently announced the launch of a more powerful Modus Toolbox ™ 3.1. Help developers easily utilize more features and develop software solutions for hardware design.

未标题-1


The ModusToolbox 3.1 launched by Infineon has added a control panel application that can centrally provide entry-level teaching resources, including key documents, training modules, video tutorials, and links to related community forums. This control panel provides workflow guidance to help developers create new embedded projects suitable for various Integrated development environment, including Microsoft Visual Studio Code, IAR Embedded Workbench, Arm ® Various development environments such as Eclipse IDE included in MDK (µ VisionIDE) or ModusToolbox. The latest version of ModusToolbox has also made significant updates to BSP Assistant, including a new user interface that allows developers to create board level support packages (BSPs) using a chip centric process. In addition, the latest version of ModusToolbox will continue to support reference BSP in the Infineon development board management library.


Clark Jarvis, market manager of software and tool technology of Infineon Technologies, said: Learning a new development tool may seem difficult, but the ModusToolbox provided by Infineon has now added a powerful control panel that provides developers with key resources, making it easier for beginners to get started than before. More importantly, in supporting developers to use BSPAssistant for development on end user hardware, this tool has made significant improvements to the support method, allowing ModusToolbox to support from start to finish Supporting developers


Infineon ModusToolbox software is a comprehensive set of development tools and embedded real-time resource files. It provides users with a flexible and efficient development environment, helping them transition seamlessly from the evaluation and prototyping stage using the Infineon development kit to creating custom BSPs through the "edit compile debug" cycle of application development, and then to the final product deployment stage.

Prev:Meiguang will invest 4.3 billion yuan to expand Xi'an Sealing and Testing Plant

Next:TSMC leads the AI chip foundry industry and is expected to continue to maintain a leading position

Hot news
Differences in the Performance of LED Core Technologies
The core performance indicators of LED devices are mainly reflected in the following six aspects
PCB wiring principles and techniques
1、 Manually wiring as much as possible
Mikroe Motion 2 Click Board Product Introduction
Mikroe Motion 2 Click is based on the Panasonic EKMC1607112 PIR motion sensor and is used as a human motion detector
SK Hynix develops a new generation of mobile NAND flash memory solutions
As the industry's highest-performance product, it will begin mass production in the third quarter of this year and be integrated into edge-side AI smartphones
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
User Info：
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message