Hi,welcome
86-755-88844016 +852 2632 9637 6*12 hours online call
STM32 STM32 USB PD microcontroller of STM32 now supports UCSI specification
2023-07-27

STMicroelectronics, a new USB Type-C, is added to STM32 microcontroller (MCU) software ecosystem of STM32 ® The Connector System Interface (UCSI) software library accelerates the development of USB-C Power Supply (PD) applications.

未标题-1


X-CUBE-UCSI is a UCSI certified turnkey solution, consisting of ready-to-use hardware and firmware examples that use STM32 MCU as a UCSI PD controller for standardized communication. Customers can copy and paste these reference designs directly and benefit from optimized Bill of materials (BoM) costs.


This software allows the MCU to connect to the main processor of the system, exchange information with the operating system using the UCSI protocol, and control the USB-C connection and PD protocol. The main processor can be a System On Chip (SoC), Application Processor, or STM32MP microprocessor, and its responsibility is the UCSI Operating System Policy Manager (OPM). The PD controller on the STM32 MCU acts as the UCSI Platform Policy Manager (PPM). Many products in STM32 MCU provide peripherals required for USB Type-C power supply (UCPD). The STM32G0 series is a lower priced USB Type-C powered microcontroller, which is an ideal low pin supporting chip for MPUs, specifically responsible for handling PD power supply functions.


The software also allows the main processor to burn firmware on the STM32 MCU during the production line and application lifecycle. The main processor uses UCSI drivers and related commands provided by Microsoft or the Linux community to exchange data with the PD controller. In addition to saving development time, the software also extends interoperability between USB-C devices, supporting the latest use cases provided by the technology.


The X-CUBE-UCSI STM32Cube extension software can help developers develop USB PD dual role power supply (DRP) applications, supporting alternating mode commands.


On the USB certified (TID 8088) Discovery board STM32MP135F-DK, the application main processor STM32MP135 is connected to the UCSI PD controller STM32G071 MCU, allowing developers to take the lead and quickly start the development process. This board also uses the TCPP03-M20 USB Type-C high-voltage port protection IC of STMicroelectronics.


More than 500 standard STM32 MCUs have implemented ST UCPD power supply control peripherals on chip. In addition, the STM32 MCU has a rich range of analog and digital peripherals as port extenders, providing greater flexibility for implementing additional functions that are not supported by the main processor.

Hot news
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
Samsung Electronics has basically completed the development of the 8nm version of eMRAM memory process upgrade
Samsung Electronics representative stated at the AI-PIM seminar in South Korea that they are gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed. As a new type of memory, MRAM is based on the principle of magnetism and has non-volatile properties. It does not need to constantly refresh data like DRAM memory, making it more energy-efficient and efficient; At the same time, the write speed of MRAM is 1000 times that of NAND, supporting applications that require higher write rates.
From January to April, the production of integrated circuits increased by 37.2% year-on-year, reaching 135.4 billion blocks
Recently, the official website of the Ministry of Industry and Information Technology showed that from January to April, China's electronic information manufacturing industry saw steady growth in production, export recovery improved, efficiency continued to improve, investment maintained rapid growth, and the overall growth trend of the industry was significant.
The NAND Flash market saw growth in the first quarter of 2024
According to TrendForce consulting research, due to the widespread use of enterprise SSDs in artificial intelligence servers starting in February 2024, as well as PC and smartphone manufacturers continuing to increase inventory to combat price increases, NAND Flash revenue increased by 28.1% month on month in the first quarter of 2024, reaching $14.71 billion.
TSMC predicts that the AI accelerator market may grow by 250%
According to information disclosed by TSMC at its technology seminar, the semiconductor market only began to recover in the second half of last year, so analysts are cautious about this year's growth. Although the growth expectations for the PC and smartphone sectors are only in single digits this year, there is one semiconductor market expected to grow by about 250%, which is the AI accelerator market.
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message