Intel and Ericsson Collaborate to Build New 5G Chips Using 18A Technology_News_ALL NEW SEMI (ANSC)

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Intel and Ericsson Collaborate to Build New 5G Chips Using 18A Technology

2023-07-28

Recently, Intel will collaborate with Swedish telecommunications equipment manufacturer Ericsson to manufacture customized chips for Ericsson's 5G network equipment using its state-of-the-art 18A process and manufacturing technology.

Intel stated that in addition to customizing chips, the two sides will also expand cooperation by utilizing Intel vRAN Boost for Ericsson Cloud RAN (Wireless Access Network) solutions to optimize the fourth generation Intel Xeon scalable processors, helping communication service providers improve network capacity and energy efficiency while achieving greater flexibility and scalability.

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In the high-end semiconductor field, Intel is no longer inferior to TSMC, and TSMC's ultra small and ultra efficient chips are popular in the market. Intel CEO Pat Gelsinger announced in 2021 that he would regain leadership and complete the 5th generation CPU process within four years.

According to relevant information, Intel18A is the most advanced process node on Intel's four year five node roadmap, based on a new ringgate transistor architecture (RibbonFET) and back-end power transmission (PowerVia) technology. Intel stated that it will provide ribbon architecture innovation and higher performance in the 18A, while continuously reducing metal line width. The combination of these technologies will enable Intel to regain its leadership position in 2025.

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