Although Samsung Electronics produced its 3-nanometer OEM business earlier than TSMC, it has fallen behind TSMC due to the loss of major customers such as Qualcomm and NVIDIA.

Zheng Jitai, CTO of Samsung Electronics wafer foundry department, stated that customers' order selection is a long-term process that takes about three years, and believes that the unfavorable situation in winning customers will improve in the future. If chip manufacturers encounter problems, customers will also suffer, so they must be cautious. However, he stated that the company is confident in securing major customers for its processes below 3nm. We are currently in negotiations with major clients regarding the upcoming 2nm, 1.4nm, and other technologies.

The GAA process is a sustainable technology for the future, while FinFET is difficult to further improve. We are in talks with major customers about the upcoming 2nm, 1.4nm, and other processes.

As for the competition among manufacturers in Chinese Mainland, he said that in the field of advanced packaging (post-processing), the competition pattern of Samsung, TSMC and Intel will continue.

Compared to front-end technology, developing back-end technology is easier for Chinese companies, but new players often find it difficult to join the competition unless they have a large number of customers to receive feedback, such as TSMC, or IDMs that both design and manufacture, such as Samsung or Intel.

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