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SK Hynix HBM3E chip in short supply and production capacity has been fully booked for next year
2023-10-30

HBM is a new type of memory that shortens the communication distance between memory and processors by vertically stacking DRM chips. Simply put, HBM can provide high bandwidth, allowing for more efficient data transmission between CPU and GPU, as well as between memory and storage.


During the third quarter financial report conference call, a leader of SK Hynix stated, "We have sold all production of next year's HBM3 and HBM3E in 2023." In addition, he also stated that he is in negotiations with clients regarding production capacity for 2025.


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HBM is a "transfer station" similar to data, which saves each frame and image data to the frame cache area and waits for GPU to call. Compared to traditional memory technology, HBM has higher bandwidth, lower power, lower power consumption, and smaller size, which can significantly improve the transmission rate and data processing capacity of AI servers. Therefore, HBM has become a standard configuration for AI servers.


As an upgraded version of HBM3, HBM3E is expected to provide strong support for Nvidia's upcoming mass production of the GH200 next year. In addition, SK Hynix also expects that even if the demand for HBM3E is strong, it will not affect the average selling price of existing HBM3 products.


Mainly because demand for DRAM is expected to recover from 2024, while demand for HBM3 remains strong. Therefore, SK Hynix plans to increase investment in 2024 to cope with expanding demand, and also plans to continuously enhance its production capacity with HBM as the center.


It is worth mentioning that HBM only has three mass production companies globally, namely SK Hynix, Samsung, and Micron. At present, SK Hynix's storage chip technology is leading Samsung and Hynix, with a market share of about 60% -70%. Due to the outbreak of downstream demand, supply cannot keep up.


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