Samsung Electronics has acquired some buildings and equipment within the Tian'an factory area of Samsung Display to expand HBM production capacity. Samsung Electronics plans to establish a new packaging line at the Tianan factory for large-scale production of HBM. The company has spent 10.5 billion Korean won to purchase the aforementioned buildings and equipment, and is expected to invest an additional 700 billion to 1 trillion Korean won.

Previously, Lee Jung bae, President of Samsung Electronics' Memory Business, stated in an article titled "Unlimited Possibilities of Releasing Samsung Memory" in the company's press room, "We are currently producing HBM3 and are successfully developing the next generation product HBM3E. We will further expand our scale and produce customized HBMs for our customers

TrendForce Consulting estimates that the shipment volume of AI servers (including those equipped with GPUs, FPGAs, ASICs, etc.) will be nearly 1.2 million in 2023, and it is expected that HBM demand will surge by 60% to 290 million GB. It is expected to increase by another 30% in 2024. The cost of HBM ranks third in the cost of AI servers, accounting for approximately 9%, with a single ASP (average selling price per machine) of up to $18000. Market research firm Omdia predicts that the total revenue of the HBM market will reach $2.5 billion in 2025.

It is reported that HBM memory is a high-performance memory module widely used in various fields with high computing needs, such as high-performance computing, servers, and data centers. According to the latest news, the maximum data transfer speed of this new type of memory has exceeded the limit of the previous generation and is expected to reach 1.228TB/s, which has a significant advantage in the current market.

At present, the market is mainly controlled by three institutions: Samsung, SK Hynix, and Micron. According to data from market tracker TrendForce, as of 2022, the company has a 50% share in the global HBM market, followed closely by Samsung Electronics at 40%, followed by Micron Technology at 10%. Samsung Electronics is based on expectations for future growth in the high-performance computing and storage market, expanding HBM production capacity in order to occupy a more competitive position in this market.

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