Hi,welcome
86-755-88844016 +852 2632 9637 6*12 hours online call
Samsung Electronics plans to invest 700-1 trillion won to expand HBM production capacity
2023-11-08

Samsung Electronics has acquired some buildings and equipment within the Tian'an factory area of Samsung Display to expand HBM production capacity. Samsung Electronics plans to establish a new packaging line at the Tianan factory for large-scale production of HBM. The company has spent 10.5 billion Korean won to purchase the aforementioned buildings and equipment, and is expected to invest an additional 700 billion to 1 trillion Korean won.


Previously, Lee Jung bae, President of Samsung Electronics' Memory Business, stated in an article titled "Unlimited Possibilities of Releasing Samsung Memory" in the company's press room, "We are currently producing HBM3 and are successfully developing the next generation product HBM3E. We will further expand our scale and produce customized HBMs for our customers


ic- (51)_20231107142412_290


TrendForce Consulting estimates that the shipment volume of AI servers (including those equipped with GPUs, FPGAs, ASICs, etc.) will be nearly 1.2 million in 2023, and it is expected that HBM demand will surge by 60% to 290 million GB. It is expected to increase by another 30% in 2024. The cost of HBM ranks third in the cost of AI servers, accounting for approximately 9%, with a single ASP (average selling price per machine) of up to $18000. Market research firm Omdia predicts that the total revenue of the HBM market will reach $2.5 billion in 2025.


It is reported that HBM memory is a high-performance memory module widely used in various fields with high computing needs, such as high-performance computing, servers, and data centers. According to the latest news, the maximum data transfer speed of this new type of memory has exceeded the limit of the previous generation and is expected to reach 1.228TB/s, which has a significant advantage in the current market.


At present, the market is mainly controlled by three institutions: Samsung, SK Hynix, and Micron. According to data from market tracker TrendForce, as of 2022, the company has a 50% share in the global HBM market, followed closely by Samsung Electronics at 40%, followed by Micron Technology at 10%. Samsung Electronics is based on expectations for future growth in the high-performance computing and storage market, expanding HBM production capacity in order to occupy a more competitive position in this market.


The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!

Prev:TI announces the official start of construction for the second 12 inch wafer factory located in Utah

Next:News says Intel has decided to shelve Vietnam's investment plan

Hot news
Samsung Electronics and Zeiss Collaborate to Strengthen Focus on EUV Technology and Semiconductor Equipment
Samsung Electronics is deepening its cooperation with Zeiss Group in next-generation EUV and chip technology. Zeiss Group is the only optical system supplier for ASML Holding NV, the world's only supplier of extreme ultraviolet (EUV) optical systems.
TSMC announces that the A16 1.6nm process is expected to be mass-produced in 2026
Recently, TSMC held the "2024 TSMC North America Technology Forum" in the United States, revealing its latest process technology, advanced packaging technology, and three-dimensional integrated circuit (3D IC) technology, using this leading semiconductor technology to drive innovation in the next generation of artificial intelligence (AI).
Samsung Electronics to Expand Silicon Valley R&D Institutions to Specially Design AI Chips
Samsung Electronics plans to expand its research and development (R&D) facility in Silicon Valley, focusing on artificial intelligence (AI) chip design. In the process of reshaping the semiconductor industry with a focus on artificial intelligence chips, Samsung aims to strengthen its design capabilities to break the current market landscape dominated by large technology companies such as Nvidia in the United States.
Storage chip prices rise, module manufacturers are unwilling to follow up
Recently, storage chip manufacturers have been insisting on raising prices, but module manufacturers have refused to purchase and are unwilling to accept price increases. According to insiders, the demand for enterprise storage and cloud data centers has remained strong, but customers in the consumer market find it difficult to bear the significant price increase.
In Q3 2023, the top 10 global semiconductor equipment manufacturers achieved revenue exceeding $25 billion, a month on month increase of 3%
According to CINNO Research statistics, the total revenue of the global semiconductor equipment manufacturer market in the third quarter of 2023 exceeded 25 billion US dollars, a year-on-year decrease of 9% and a month on month increase of 3%.
Li Jidian plans to build a factory in Japan to promote its automotive chip business
The head of Power Semiconductor Manufacturing (PSMC) recently stated that the company will use its new factory in Japan as a springboard to significantly expand its automotive semiconductor business. "Japan has huge opportunities," said Huang Chongren, CEO of Li Jidian, in a media interview. Japan has a broad market prospect and a geographical advantage where many car companies gather.
Samsung's low-priced challenge to TSMC's 2nm battle begins
According to insiders, TSMC has demonstrated the process testing results of N2 (i.e. 2 nanometers) prototypes to its major customers such as Apple and Nvidia. Samsung is also actively launching a 2-nanometer prototype and adopting a low-cost strategy to attract customers such as Nvidia.
Nikon launches a new ArF immersion lithography machine, which is 30% cheaper in price
Recently, Nikon announced that it will officially launch the ArF 193 nano immersion lithography machine "NSR-S636E" in January 2024, which will further improve production efficiency and etching accuracy. It is reported that Nikon's exposure machine adopts an enhanced iAS design, which can be used for high-precision measurement, circular warping, and distortion correction. The overlap accuracy (MMO) is higher, claiming to not exceed 2.1 nanometers.
Intel's appeal wins $2.18 billion compensation judgment overturned
The Federal Circuit Court of Appeals in the United States has announced the overturning of a 2021 ruling by a Texas court jury, which found Intel to be liable for $2.18 billion in compensation to patent technology company VLSI for patent infringement. This is one of the largest rulings in US patent history. The appellate court held that Intel's infringement of one patent involving $675 million in compensation does not constitute infringement, while the infringement of the other patent involving $1.5 billion in compensation remains valid, but the amount of compensation needs to be reconsidered by the Texas court.
Spend 5 billion euros! STMicroelectronics will build a new SiC wafer factory
Recently, STMicroelectronics has decided to further expand its production facilities by establishing a brand new silicon carbide (SiC) semiconductor wafer fab in Catane, Sicily, Italy. The total investment amount is up to 5 billion euros, and the wafer factory will specialize in producing silicon carbide chips, which are key technologies for electric vehicles and have strong growth potential.
User Info：
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message