Recently, Texas Instruments (TI) announced that it is breaking ground on its second 300mm semiconductor wafer factory located in Lehi, Utah. After completion, TI's two factories in Utah will produce tens of millions of analog and embedded processing chips at full capacity every day.

Haviv Ilan, President and CEO of Texas Instruments, said: Today, we have taken an important step towards expanding our company's manufacturing layout. This new wafer factory is part of our long-term plan for 12 inch wafer production capacity, aimed at meeting the needs of our customers for decades to come. At Texas Instruments, we are committed to using semiconductor technology to make electronic products more economical and make the world a better place. We are very proud to manufacture analog and embedded processing semiconductors that are suitable for almost all types of electricity today All subsystems are crucial

In February of this year, Texas Instruments announced an investment of $11 billion in Utah, the largest economic investment in the state's history. LFAB2 will create approximately 800 additional jobs and thousands of indirect jobs for TI, with the first batch of production expected to be put into operation as early as 2026.

Texas Instruments' newly built LFAB2 will supplement its existing 300mm wafer plant, including LFAB1 (Leehom, Utah), DMOS6 (Dallas), as well as RFAB1 and RFAB2 (both located in Richardson, Texas). Among them, Texas Instruments is also building four new 300mm wafer factories (SM1, SM2, SM3, and SM4) in Sherman, Texas, with the first wafer factory expected to start production as early as 2025.

It is reported that the wafer factory is adjacent to the existing 12 inch wafer factory of Texas Instruments located in Li Hai. After completion, Texas Instruments' two wafer factories in Utah will produce tens of millions of analog and embedded processing chips per day at full capacity.

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