86-755-88844016 6*12 hours online call
Apple's self-developed 5G modem has been postponed until the end of 2025

The 5G modem project independently developed by Apple has been highly anticipated, but faces new challenges. According to Bloomberg reporter Mark Gurman's latest Power On newsletter, the release time of Apple's self-developed 5G modem may be delayed again, as early as the end of 2025.

In 2019, Apple acquired most of Intel's smartphone business and began seriously developing its own modem hardware, aiming to reduce dependence on suppliers such as Qualcomm. However, the development process of self-developed 5G modems has not been smooth and faces various challenges and difficulties.

Apple initially planned to launch its own internal modem chip before 2024, but this goal could not be achieved. Now, according to Gulman, Apple is also unable to catch up with the delayed spring 2025 release schedule. At present, the release of modem chips has been postponed to the end of 2025 or the beginning of 2026, and Apple still intends to use this technology first in the low-end iPhone SE version.

At present, the development of modem chips is still at an early stage, "which may be several years behind the competitors". The version being developed does not support faster millimeter wave technology, and Apple has also encountered issues with Intel code that require rewriting and optimization. In addition, Apple must also avoid infringing Qualcomm's patent rights when developing chips.

It is reported that an Apple employee said to Gulman, "Why do we think we can take over a failed project from Intel and achieve success in some way? This is a mystery." It is said that Apple's hardware technology team is "struggling" in many projects, making it difficult to fix errors.

Apple's dissatisfaction with Qualcomm began in 2017, when Apple sued Qualcomm for unfairly charging unrelated technology patent fees. Apple believes that Qualcomm charges too much for its modem chip technology. According to the new agreement, Qualcomm will supply Snapdragon series 5G modems and RF systems for Apple's iPhones launched in 2024, 2025, and 2026.

The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!

Hot news
SK Hynix plans to adopt 2.5D fanout packaging technology for the next generation HBM
SK Hynix is preparing to launch a 2.5D fanout package as its next-generation storage semiconductor technology. SK Hynix has achieved success in the high bandwidth memory (HBM) field this year and is confident in the next generation chip technology field, seemingly ensuring its technological leadership by developing "professional" memory products. According to South Korean media Business Korea, SK Hynix is preparing to integrate 2.5D fanout packaging technology into its next generation DRAM after HBM.
Mitsubishi Electric collaborates with Anse to develop SiC power semiconductors
Recently, Mitsubishi Electric and Nexperia announced their joint development of efficient silicon carbide (SiC) MOSFET discrete power semiconductors. Mitsubishi Electric will develop and supply SiC MOSFET chips to Nexperia, while Nexperia will develop SiC discrete components equipped with Mitsubishi Electric's chips.
The storage market is deadlocked, and buyers and sellers are engaged in a tug of war
According to reports, the DRAM spot market prices have been in a stalemate recently. Among them, the price of DDR5 16G showed a significant decline in the first half of the past week and then slightly increased, while the price of DDR4 8G remained stable and slightly decreased.
The institution predicts that the annual growth rate of the HBM market will reach 52% in the next four years
Due to the surge in demand for artificial intelligence, the prices and demand for HBM and DDR5 are both increasing. The price of HBM is 5-6 times that of existing DRAM products; The price of DDR5 is also 15% to 20% higher than that of DDR4. From this year to 2027, the annual growth rate of DRAM market revenue is expected to be 21%, while the HBM market is expected to soar by 52%. HBM's share of DRAM market revenue is expected to exceed 10% this year and approach 20% by 2027.
German subsidies or current variables affecting Intel and TSMC's plans to build factories
Recently, a ruling by the Federal Constitutional Court of Germany resulted in the postponement of the country's 2024 federal budget. All government expenditures may be subject to scrutiny, which could result in chip manufacturers such as Intel and TSMC losing significant subsidies.
Botong's $69 billion acquisition of VMWare has been conditionally approved by China
Chip giant Broadcom announced on Tuesday that it plans to complete a $69 billion acquisition of cloud computing company VMWare on Wednesday. The merger between Broadcom and VMware is one of the largest technology industry transactions in history, and although it has been approved by the European Union, the UK, South Korea, and Japan, it still requires approval from China.
TSMC plans to build a third factory in Japan to produce 3-nanometer chips
According to insiders, TSMC is considering building a third chip factory in Japan to produce advanced 3-nanometer chips; This may make Japan an important global chip manufacturing center. Insiders said that the chip foundry has informed supply chain partners that it is considering building a third factory in Kumamoto Prefecture, southern Japan, under the project code TSMC Fab-23 Phase III.
SK Hynix will use its subsidiary's KrF PR for 238 layer NAND flash memory
According to reports, SK Hynix acquired the electronic materials business unit of Jinhu Petrochemical for approximately RMB 2.22 billion in 2020. Recently, according to The Elec, the thick KrF photoresist (PR) developed by SK Hynix has passed the company's quality inspection.
TSMC Wins Microsoft 5nm AI Chip Order
According to industry insiders, TSMC has received orders for artificial intelligence (AI) chips from major cloud service providers (CSPs), including Microsoft's 5nm chip order.
Samsung plans to launch 3D AI chip packaging "SAINT" in 2024
As semiconductor microfabrication processes approach the physical limit, advanced packaging technology has become the focus of competition. TSMC is the first to launch the 3Dfabric platform, and Samsung plans to launch the "SAINT" advanced 3D chip packaging technology to catch up.
User Info:
Phone number
  • +86
  • +886
  • +852
Company Name
Product model
Comment message