Hi,welcome
+86 135 5637 6665 +852 2632 9637 6*12 hours online call
Apple's self-developed 5G modem has been postponed until the end of 2025
2023-11-20

The 5G modem project independently developed by Apple has been highly anticipated, but faces new challenges. According to Bloomberg reporter Mark Gurman's latest Power On newsletter, the release time of Apple's self-developed 5G modem may be delayed again, as early as the end of 2025.


In 2019, Apple acquired most of Intel's smartphone business and began seriously developing its own modem hardware, aiming to reduce dependence on suppliers such as Qualcomm. However, the development process of self-developed 5G modems has not been smooth and faces various challenges and difficulties.



Apple initially planned to launch its own internal modem chip before 2024, but this goal could not be achieved. Now, according to Gulman, Apple is also unable to catch up with the delayed spring 2025 release schedule. At present, the release of modem chips has been postponed to the end of 2025 or the beginning of 2026, and Apple still intends to use this technology first in the low-end iPhone SE version.


At present, the development of modem chips is still at an early stage, "which may be several years behind the competitors". The version being developed does not support faster millimeter wave technology, and Apple has also encountered issues with Intel code that require rewriting and optimization. In addition, Apple must also avoid infringing Qualcomm's patent rights when developing chips.


It is reported that an Apple employee said to Gulman, "Why do we think we can take over a failed project from Intel and achieve success in some way? This is a mystery." It is said that Apple's hardware technology team is "struggling" in many projects, making it difficult to fix errors.


Apple's dissatisfaction with Qualcomm began in 2017, when Apple sued Qualcomm for unfairly charging unrelated technology patent fees. Apple believes that Qualcomm charges too much for its modem chip technology. According to the new agreement, Qualcomm will supply Snapdragon series 5G modems and RF systems for Apple's iPhones launched in 2024, 2025, and 2026.


The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!

Hot news
Differences in the Performance of LED Core Technologies
The core performance indicators of LED devices are mainly reflected in the following six aspects
PCB wiring principles and techniques
1、 Manually wiring as much as possible
Mikroe Motion 2 Click Board Product Introduction
Mikroe Motion 2 Click is based on the Panasonic EKMC1607112 PIR motion sensor and is used as a human motion detector
SK Hynix develops a new generation of mobile NAND flash memory solutions
As the industry's highest-performance product, it will begin mass production in the third quarter of this year and be integrated into edge-side AI smartphones
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message