86-755-88844016 6*12 hours online call
STM Announces Important Agreement with ZF to Provide High Performance Silicon Carbide Devices

According to media reports, STM has signed a long-term supply agreement with ZF to provide silicon carbide devices to ZF. Silicon carbide devices are high-performance and highly reliable power electronic devices commonly used in switch and control circuits in automotive power systems. STM's silicon carbide devices will provide higher performance, lower power consumption, and greater reliability, providing better solutions for ZF's automotive power system.

Starting from 2025, ZF will purchase silicon carbide devices from STM. According to the terms of this long-term procurement contract, STM will supply over 10 million silicon carbide devices to ZF. ZF plans to integrate these devices into a new modular inverter architecture for mass production in 2025, utilizing STM's vertically integrated silicon carbide production lines in Europe and Asia to ensure the completion of electric drive customer orders.

Stephan von Schuckmann, a member of the management committee responsible for electric drive and material management at ZF, stated: We will strengthen our company's supply chain through this strategically important initiative to ensure safe supply for our customers. By 2030, our electric drive orders have exceeded 30 billion euros. To complete this order volume, we need the support of multiple reliable silicon carbide suppliers. ST's experience in complex system research and development meets our requirements, and most importantly, ST's product quality is superior, and the production capacity can also meet our needs 。” ZF announced its existing silicon carbide technology cooperation agreement in February of this year, and the new agreement signed with STM represents the support of ZF from a top global silicon carbide technology supplier.


Marco Monti, President of STM Automotive and Discrete Device Products (ADG), stated: As a vertically integrated semiconductor manufacturing enterprise, we are investing heavily in expanding production capacity, developing silicon carbide supply chains, and helping our automotive and industrial customers worldwide and in Europe achieve electrification and low-carbon goals. Higher scalability and modularity, as well as higher energy efficiency, peak power, and cost reduction, are key to the success of electric vehicle technology. Our silicon carbide technology helps to achieve these advantages. We are very Proud of collaborating with advanced automotive electrification supplier ZF to help them achieve differentiation and optimize inverter performance.

STM will produce silicon carbide chips at wafer factories in Italy and Singapore, using STM's advanced STPAK packaging, and complete testing at post processing factories in Morocco and China.

ZF can connect different quantities of silicon carbide chips to meet customer performance requirements.

STM will supply over ten million third-generation silicon carbide MOSFET devices to ZF starting from 2025. ZF can connect different numbers of silicon carbide chips to meet customers' performance requirements without changing the inverter design. ZF will use this technology to develop electric drive inverters for a European automotive manufacturer and plans to start production in 2025.

The inverter is the brain of the electric vehicle electric drive system, responsible for managing the energy transmission between the battery and the motor. With the development and progress of electric drive systems, inverters have become more efficient and complex. The combination of inverter design and semiconductor technologies such as silicon carbide is the key to improving the performance of electric vehicles. Silicon carbide devices can significantly reduce power losses in electric vehicle inverters, wind turbines, and photovoltaic inverters. Compared to traditional silicon based products, silicon carbide devices have a decisive advantage in providing higher energy efficiency, power density, and reliability, while also achieving smaller and more cost-effective system designs. In short, electric vehicles equipped with silicon carbide power devices have faster charging speeds, longer range, and larger internal space.

This long-term supply agreement is an important development for STM in the automotive industry and also marks its further expansion in the power semiconductor device market. At the same time, this is also an important measure for STM to strengthen its cooperation with automotive manufacturers and provide them with better semiconductor products and services.

Hot news
In Q3 2023, the top 10 global semiconductor equipment manufacturers achieved revenue exceeding $25 billion, a month on month increase of 3%
According to CINNO Research statistics, the total revenue of the global semiconductor equipment manufacturer market in the third quarter of 2023 exceeded 25 billion US dollars, a year-on-year decrease of 9% and a month on month increase of 3%.
Li Jidian plans to build a factory in Japan to promote its automotive chip business
The head of Power Semiconductor Manufacturing (PSMC) recently stated that the company will use its new factory in Japan as a springboard to significantly expand its automotive semiconductor business. "Japan has huge opportunities," said Huang Chongren, CEO of Li Jidian, in a media interview. Japan has a broad market prospect and a geographical advantage where many car companies gather.
Samsung's low-priced challenge to TSMC's 2nm battle begins
According to insiders, TSMC has demonstrated the process testing results of N2 (i.e. 2 nanometers) prototypes to its major customers such as Apple and Nvidia. Samsung is also actively launching a 2-nanometer prototype and adopting a low-cost strategy to attract customers such as Nvidia.
Nikon launches a new ArF immersion lithography machine, which is 30% cheaper in price
Recently, Nikon announced that it will officially launch the ArF 193 nano immersion lithography machine "NSR-S636E" in January 2024, which will further improve production efficiency and etching accuracy. It is reported that Nikon's exposure machine adopts an enhanced iAS design, which can be used for high-precision measurement, circular warping, and distortion correction. The overlap accuracy (MMO) is higher, claiming to not exceed 2.1 nanometers.
Intel's appeal wins $2.18 billion compensation judgment overturned
The Federal Circuit Court of Appeals in the United States has announced the overturning of a 2021 ruling by a Texas court jury, which found Intel to be liable for $2.18 billion in compensation to patent technology company VLSI for patent infringement. This is one of the largest rulings in US patent history. The appellate court held that Intel's infringement of one patent involving $675 million in compensation does not constitute infringement, while the infringement of the other patent involving $1.5 billion in compensation remains valid, but the amount of compensation needs to be reconsidered by the Texas court.
Spend 5 billion euros! STMicroelectronics will build a new SiC wafer factory
Recently, STMicroelectronics has decided to further expand its production facilities by establishing a brand new silicon carbide (SiC) semiconductor wafer fab in Catane, Sicily, Italy. The total investment amount is up to 5 billion euros, and the wafer factory will specialize in producing silicon carbide chips, which are key technologies for electric vehicles and have strong growth potential.
AMD plans to establish the world's largest design center in India
AMD announced the opening of its largest global design center, AMD Technostar, in Bangalore, India. This move is also part of AMD's global expansion, aimed at enhancing its competitiveness in the fiercely competitive semiconductor market.
Apple may abandon independent research and development of 5G modem chips
Supply chain sources have revealed that Apple may decide to stop developing its self-developed 5G modem chip after multiple failed attempts to improve it.
Samsung Electronics CIS products have seen a maximum price increase of 30%
After a long period of downturn, the consumer electronics industry has finally ushered in the dawn of recovery. Recently, media reports have reported that Samsung Electronics has issued a CIS price increase notice to customers, with an average increase of up to 25% in the first quarter of next year, and some products have seen the highest increase of up to 30%. The price increase mainly focuses on products with specifications above 32 million pixels.
Samsung suspends NAND flash memory shipments, Q4 storage chip contract price exceeds expectations
Although most terminal products have had mediocre sales during recent promotional periods, the spot prices of storage chips are still showing an upward trend despite significant production cuts and production control by Samsung, SK Hynix, and Micron. Among them, due to more severe losses, the increase in NAND storage chips is more significant.
User Info:
Phone number
  • +86
  • +886
  • +852
Company Name
Product model
Comment message