Hi,welcome
86-755-88844016 +852 2632 9637 6*12 hours online call
STM Announces Important Agreement with ZF to Provide High Performance Silicon Carbide Devices
2023-05-11

According to media reports, STM has signed a long-term supply agreement with ZF to provide silicon carbide devices to ZF. Silicon carbide devices are high-performance and highly reliable power electronic devices commonly used in switch and control circuits in automotive power systems. STM's silicon carbide devices will provide higher performance, lower power consumption, and greater reliability, providing better solutions for ZF's automotive power system.


Starting from 2025, ZF will purchase silicon carbide devices from STM. According to the terms of this long-term procurement contract, STM will supply over 10 million silicon carbide devices to ZF. ZF plans to integrate these devices into a new modular inverter architecture for mass production in 2025, utilizing STM's vertically integrated silicon carbide production lines in Europe and Asia to ensure the completion of electric drive customer orders.


Stephan von Schuckmann, a member of the management committee responsible for electric drive and material management at ZF, stated: We will strengthen our company's supply chain through this strategically important initiative to ensure safe supply for our customers. By 2030, our electric drive orders have exceeded 30 billion euros. To complete this order volume, we need the support of multiple reliable silicon carbide suppliers. ST's experience in complex system research and development meets our requirements, and most importantly, ST's product quality is superior, and the production capacity can also meet our needs 。” ZF announced its existing silicon carbide technology cooperation agreement in February of this year, and the new agreement signed with STM represents the support of ZF from a top global silicon carbide technology supplier.

未标题-2


Marco Monti, President of STM Automotive and Discrete Device Products (ADG), stated: As a vertically integrated semiconductor manufacturing enterprise, we are investing heavily in expanding production capacity, developing silicon carbide supply chains, and helping our automotive and industrial customers worldwide and in Europe achieve electrification and low-carbon goals. Higher scalability and modularity, as well as higher energy efficiency, peak power, and cost reduction, are key to the success of electric vehicle technology. Our silicon carbide technology helps to achieve these advantages. We are very Proud of collaborating with advanced automotive electrification supplier ZF to help them achieve differentiation and optimize inverter performance.


STM will produce silicon carbide chips at wafer factories in Italy and Singapore, using STM's advanced STPAK packaging, and complete testing at post processing factories in Morocco and China.


ZF can connect different quantities of silicon carbide chips to meet customer performance requirements.


STM will supply over ten million third-generation silicon carbide MOSFET devices to ZF starting from 2025. ZF can connect different numbers of silicon carbide chips to meet customers' performance requirements without changing the inverter design. ZF will use this technology to develop electric drive inverters for a European automotive manufacturer and plans to start production in 2025.


The inverter is the brain of the electric vehicle electric drive system, responsible for managing the energy transmission between the battery and the motor. With the development and progress of electric drive systems, inverters have become more efficient and complex. The combination of inverter design and semiconductor technologies such as silicon carbide is the key to improving the performance of electric vehicles. Silicon carbide devices can significantly reduce power losses in electric vehicle inverters, wind turbines, and photovoltaic inverters. Compared to traditional silicon based products, silicon carbide devices have a decisive advantage in providing higher energy efficiency, power density, and reliability, while also achieving smaller and more cost-effective system designs. In short, electric vehicles equipped with silicon carbide power devices have faster charging speeds, longer range, and larger internal space.


This long-term supply agreement is an important development for STM in the automotive industry and also marks its further expansion in the power semiconductor device market. At the same time, this is also an important measure for STM to strengthen its cooperation with automotive manufacturers and provide them with better semiconductor products and services.

Hot news
Samsung is about to mass produce Galaxy Tab S10
According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.
Samsung announces chip manufacturing technology roadmap
According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.
NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory
On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.
Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time
Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.
Passive component leader National Giant plans to transform into IDM company
In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.
Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard
According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".
Samsung Electronics has basically completed the development of the 8nm version of eMRAM memory process upgrade
Samsung Electronics representative stated at the AI-PIM seminar in South Korea that they are gradually advancing the process upgrade of eMRAM memory as planned, and the technology development of 8nm eMRAM has been basically completed. As a new type of memory, MRAM is based on the principle of magnetism and has non-volatile properties. It does not need to constantly refresh data like DRAM memory, making it more energy-efficient and efficient; At the same time, the write speed of MRAM is 1000 times that of NAND, supporting applications that require higher write rates.
From January to April, the production of integrated circuits increased by 37.2% year-on-year, reaching 135.4 billion blocks
Recently, the official website of the Ministry of Industry and Information Technology showed that from January to April, China's electronic information manufacturing industry saw steady growth in production, export recovery improved, efficiency continued to improve, investment maintained rapid growth, and the overall growth trend of the industry was significant.
The NAND Flash market saw growth in the first quarter of 2024
According to TrendForce consulting research, due to the widespread use of enterprise SSDs in artificial intelligence servers starting in February 2024, as well as PC and smartphone manufacturers continuing to increase inventory to combat price increases, NAND Flash revenue increased by 28.1% month on month in the first quarter of 2024, reaching $14.71 billion.
TSMC predicts that the AI accelerator market may grow by 250%
According to information disclosed by TSMC at its technology seminar, the semiconductor market only began to recover in the second half of last year, so analysts are cautious about this year's growth. Although the growth expectations for the PC and smartphone sectors are only in single digits this year, there is one semiconductor market expected to grow by about 250%, which is the AI accelerator market.
User Info:
Phone number
+86
  • +86
  • +886
  • +852
Company Name
Email
Product model
Quantity
Comment message