According to the news, TSMC has collaborated with major clients such as Broadcom and Nvidia to develop new products such as silicon photonic technology and co packaging optical components. The process technology has been extended from 45nm to 7nm, with large orders starting from the second half of next year at the earliest. It is expected to enter the stage of large-scale production by 2025.
Regarding related rumors, TSMC stated that it will not respond to customers or product conditions. However, TSMC highly values silicon photon technology. Vice President Yu Zhenhua of TSMC recently publicly stated, "If we can provide a good silicon photon integration system, we can solve the two key issues of energy efficiency and AI computing ability. This will be a new paradigm shift. We may be at the beginning of a new era
Industry analysis shows that high-speed data transmission still uses pluggable optical components. With the rapid progress of transmission speed and the entry of the 800G generation, as well as higher transmission rates such as 1.6T to 3.2T in the future, power loss and heat dissipation management issues will be the biggest challenges.
Silicon Photonics technology uses laser beam instead of electronic signal to transmit data. It is integrated into a single module through CPO packaging technology. It has been certified by Microsoft, Meta and other major manufacturers and is used in the new generation network architecture.
Industry insiders have revealed that TSMC has invested over 200 people to form an advanced research and development team. Regarding related rumors, TSMC stated that it will not respond to customers or product conditions.
The copyright of this article belongs to the original author. The reprint of the article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us immediately to modify or delete it. Thank you for your attention!