According to market rumors, mobile chip giant Qualcomm will become the third customer to produce its next generation 5G flagship chip using TSMC's 3nm process after Apple and MediaTek. The news is expected to be announced in late October.

TSMC's 3nm process is expected to receive orders from major manufacturers such as NVIDIA and AMD. As relevant indicators are gradually met and mass production begins, TSMC's 3nm continues to lead its competitors and remains the preferred choice for international manufacturers.

Last year, Qualcomm announced at the Snapdragon Summit that the annual 5G flagship chip, "Snapdragon 8 Gen 2," was built by TSMC's 4-nanometer process; The previous generation of Qualcomm's Snapdragon 8 Gen 1 was produced by Samsung's 4-nanometer process. However, due to issues with heat dissipation, Qualcomm urgently launched an upgraded version of Snapdragon 8+Gen 1 and switched to TSMC's 4-nanometer process.

Qualcomm has always adopted a diversified supplier strategy in the selection of wafer foundries. According to industry reports, Qualcomm has privately informed mobile phone brand customers that the next generation 5G flagship chip, "Snapdragon 8 Gen 3," is expected to be released in late October, and is available in TSMC's 4 nanometer (N4P) and 3 nanometer (N3E) process versions.

At present, TSMC's main customer for 3nm is Apple. Apple's latest iPhone 15 Pro and iPhone 15 Pro Max models are equipped with the A17 Pro chip, which is produced by TSMC at 3nm and is also the first batch of TSMC's 3nm products. It is rumored that Apple has already contracted the initial production capacity of TSMC at 3nm.

Qualcomm did not respond to the rumors, while TSMC did not comment.

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