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SK Hynix plans to adopt 2.5D fanout packaging technology for the next generation HBM
2023-11-29

SK Hynix is preparing to launch a 2.5D fanout package as its next-generation storage semiconductor technology. SK Hynix has achieved success in the high bandwidth memory (HBM) field this year and is confident in the next generation chip technology field, seemingly ensuring its technological leadership by developing "professional" memory products. According to South Korean media Business Korea, SK Hynix is preparing to integrate 2.5D fanout packaging technology into its next generation DRAM after HBM.


This packaging scheme involves placing two DRAM chips horizontally side by side and then combining them into one chip. The advantage of this solution is that there is no substrate added below the chip, which can make the finished microcircuit thinner. SK Hynix will publicly announce its research results using this packaging method as soon as next year.


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SK Hynix's attempt is very unique because 2.5D fanout packaging has never been attempted in the memory industry. This technology is mainly applied in the field of advanced system semiconductor manufacturing. TSMC commercialized Fan Out Chip Level Package (FOWLP) for the first time in 2016, integrating its 16 nanometer application processor and mobile DRAM into one package on the iPhone 7, thus bringing this technology to the stage. Samsung Electronics has been incorporating this technology into the advanced AP packaging of Galaxy smartphones since the fourth quarter of this year.


The vertical integration of HBM storage chips can significantly increase interface bandwidth, but the cost is high. SK Hynix's "2.5D fan out" can effectively reduce the production cost of DRAM chips and is expected to be used in GDDR graphics memory for gaming graphics cards.


In addition to utilizing this technology, SK Hynix is also striving to consolidate its cooperation with Nvidia, which is in a leading position in the HBM market. In addition, SK Hynix has also produced and supplied dedicated DRAM for the "R1" computing unit installed in Apple's new AR device, Vision Pro. "In the era of artificial intelligence, we will innovate storage semiconductors and provide differentiated professional products for each customer," said Guo Nuozhen, President of SK Hynix


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