Samsung suspends NAND flash memory shipments, Q4 storage chip contract price exceeds expectations_News

Differences in the Performance of LED Core Technologies

The core performance indicators of LED devices are mainly reflected in the following six aspects

PCB wiring principles and techniques

1、 Manually wiring as much as possible

Mikroe Motion 2 Click Board Product Introduction

Mikroe Motion 2 Click is based on the Panasonic EKMC1607112 PIR motion sensor and is used as a human motion detector

SK Hynix develops a new generation of mobile NAND flash memory solutions

As the industry's highest-performance product, it will begin mass production in the third quarter of this year and be integrated into edge-side AI smartphones

Samsung is about to mass produce Galaxy Tab S10

According to media reports, Samsung is about to launch a new generation of Galaxy Tab S10 series, which is testing the Galaxy Tab S10+equipped with MediaTek Dimensity 9300+, changing the previous strategy of Qualcomm Snapdragon chip monopoly.

Samsung announces chip manufacturing technology roadmap

According to reports, Samsung Electronics announced its technology roadmap for chip manufacturing at its annual foundry forum held at its US chip headquarters in San Jose, California, with the aim of enhancing its competitiveness in the artificial intelligence chip foundry market through a series of upcoming technological advancements. Despite Samsung's strong position as a leading global memory chip manufacturer, it has always faced strong challenges from competitors such as TSMC in the field of wafer foundry.

NXP and World Advanced Plan Invest $7.8 billion in Singapore to Build a Wafer Factory

On June 5th, World Advanced and NXP Semiconductors announced plans to jointly establish the VisionPower Semiconductor Manufacturing Company (VSMC) joint venture in Singapore to build a 12 inch (300mm) wafer fab. The wafer factory has an investment of approximately 7.8 billion US dollars, with World Advanced investing 2.4 billion US dollars to hold 60% equity, and NXP investing 1.6 billion US dollars to hold 40% equity.

Mitsubishi Electric Kumamoto Prefecture SiC Wafer Factory to Start Production Ahead of Time

Recently, Mitsubishi Electric announced at a performance briefing that its SiC wafer plant located in Kumamoto Prefecture will be put into operation ahead of schedule due to strong market demand. The factory, originally scheduled to start operation in April 2026, will be put into production in November 2025, about 5 months ahead of schedule.

Passive component leader National Giant plans to transform into IDM company

In the past 5 to 10 years, Guoju has been steadily developing, consciously investing in new corporate groups through mergers and private equity investments.

Intel, Microsoft, Broadcom and other eight giants jointly launch the UALink standard

According to reports, Intel, Google, Microsoft, Meta, and other tech giants have announced the establishment of a new industry organization called "Ultra Accelerator Link (UALink) Promotion Group".