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Samsung and SK Hynix Q3 semiconductor inventories remain at high levels

The semiconductor libraries of Samsung and SK Hynix also maintained a high level in the third quarter of 2023. According to Samsung's quarterly report, as of the third quarter of 2023, its overall inventory amount was 55.2 trillion won, an increase of 5.9% from 52.1 trillion won at the end of 2022; The inventory amount of semiconductors has significantly increased by 16.1% from 29 trillion won at the end of 2022 to 33.7 trillion won, an increase of more than twice compared to the end of 2021.

2023-11-16

SK Hynix HBM's shipment volume is expected to increase significantly, reaching 100 million by 2030

SK Hynix CEO Jeong ho Park revealed in his speech on the 13th that the company's high bandwidth memory (HBM) shipment this year is 500000 units, and it is expected to reach 100 million units per year by 2030.

2023-11-15

Advanced process competition among wafer foundry giants entering white-hot stage

The advanced process investment of wafer foundry giants stems from the explosion of demand in the chip market. With the promotion of emerging technologies such as AI and high-performance computing, the importance of advanced manufacturing processes in the wafer foundry industry has become increasingly prominent, attracting wafer foundry companies such as TSMC, Samsung, and Intel to accelerate the introduction of more advanced manufacturing technologies to meet the continuous growth of market demand.

2023-11-14

Samsung Releases 2.1D Semiconductor Packaging Technology Cost May Reduce by 22%

Samsung has recently introduced the next generation (2.3D) semiconductor packaging technology to strengthen its competition with Intel and TSMC, which can be used to package high-performance semiconductors such as AI chips. It is reported that this packaging technology can reduce costs by 22% without sacrificing performance.

2023-11-13

Bosch, Infineon, and NXP have been approved by Germany to invest in TSMC chip factories

Recently, the German antitrust agency announced approval for Bosch, Infineon, and NXP to invest in TSMC's German Dresden 12 inch chip factory.

2023-11-11

Reza Electronics Releases Next Generation MCU Chips and Roadmap

Reza Electronics, a global semiconductor solution provider, recently unveiled its next generation System on Chip (SoC) and Microcontroller (MCU) plans for all major applications in the automotive industry. As of now, the average annual shipment volume of all Ruisa MCUs in recent years has exceeded 3.5 billion, of which about 50% is used in the automotive industry, while the rest is used in industries, the Internet of Things, data centers, and communication infrastructure.

2023-11-10

News says Intel has decided to shelve Vietnam's investment plan

Currently, Vietnam has Intel's largest chip assembly, packaging, and testing factory. In February of this year, it was revealed that Intel plans to add $1 billion worth of investment in Vietnam to enhance its chip cluster effect in Vietnam. However, the latest news indicates that Intel has shelved its new investment plan in Vietnam.

2023-11-09