Spend 5 billion euros! STMicroelectronics will build a new SiC wafer factory

Recently, STMicroelectronics has decided to further expand its production facilities by establishing a brand new silicon carbide (SiC) semiconductor wafer fab in Catane, Sicily, Italy. The total investment amount is up to 5 billion euros, and the wafer factory will specialize in producing silicon carbide chips, which are key technologies for electric vehicles and have strong growth potential.

2023-12-06

AMD plans to establish the world's largest design center in India

AMD announced the opening of its largest global design center, AMD Technostar, in Bangalore, India. This move is also part of AMD's global expansion, aimed at enhancing its competitiveness in the fiercely competitive semiconductor market.

2023-12-05

Apple may abandon independent research and development of 5G modem chips

Supply chain sources have revealed that Apple may decide to stop developing its self-developed 5G modem chip after multiple failed attempts to improve it.

2023-12-04

Samsung Electronics CIS products have seen a maximum price increase of 30%

After a long period of downturn, the consumer electronics industry has finally ushered in the dawn of recovery. Recently, media reports have reported that Samsung Electronics has issued a CIS price increase notice to customers, with an average increase of up to 25% in the first quarter of next year, and some products have seen the highest increase of up to 30%. The price increase mainly focuses on products with specifications above 32 million pixels.

2023-12-01

Samsung suspends NAND flash memory shipments, Q4 storage chip contract price exceeds expectations

Although most terminal products have had mediocre sales during recent promotional periods, the spot prices of storage chips are still showing an upward trend despite significant production cuts and production control by Samsung, SK Hynix, and Micron. Among them, due to more severe losses, the increase in NAND storage chips is more significant.

2023-12-01

SK Hynix plans to adopt 2.5D fanout packaging technology for the next generation HBM

SK Hynix is preparing to launch a 2.5D fanout package as its next-generation storage semiconductor technology. SK Hynix has achieved success in the high bandwidth memory (HBM) field this year and is confident in the next generation chip technology field, seemingly ensuring its technological leadership by developing "professional" memory products. According to South Korean media Business Korea, SK Hynix is preparing to integrate 2.5D fanout packaging technology into its next generation DRAM after HBM.

2023-11-29

Mitsubishi Electric collaborates with Anse to develop SiC power semiconductors

Recently, Mitsubishi Electric and Nexperia announced their joint development of efficient silicon carbide (SiC) MOSFET discrete power semiconductors. Mitsubishi Electric will develop and supply SiC MOSFET chips to Nexperia, while Nexperia will develop SiC discrete components equipped with Mitsubishi Electric's chips.

2023-11-28

The storage market is deadlocked, and buyers and sellers are engaged in a tug of war

According to reports, the DRAM spot market prices have been in a stalemate recently. Among them, the price of DDR5 16G showed a significant decline in the first half of the past week and then slightly increased, while the price of DDR4 8G remained stable and slightly decreased.

2023-11-27

The institution predicts that the annual growth rate of the HBM market will reach 52% in the next four years

Due to the surge in demand for artificial intelligence, the prices and demand for HBM and DDR5 are both increasing. The price of HBM is 5-6 times that of existing DRAM products; The price of DDR5 is also 15% to 20% higher than that of DDR4. From this year to 2027, the annual growth rate of DRAM market revenue is expected to be 21%, while the HBM market is expected to soar by 52%. HBM's share of DRAM market revenue is expected to exceed 10% this year and approach 20% by 2027.

2023-11-25

German subsidies or current variables affecting Intel and TSMC's plans to build factories

Recently, a ruling by the Federal Constitutional Court of Germany resulted in the postponement of the country's 2024 federal budget. All government expenditures may be subject to scrutiny, which could result in chip manufacturers such as Intel and TSMC losing significant subsidies.

2023-11-24

Botong's $69 billion acquisition of VMWare has been conditionally approved by China

Chip giant Broadcom announced on Tuesday that it plans to complete a $69 billion acquisition of cloud computing company VMWare on Wednesday. The merger between Broadcom and VMware is one of the largest technology industry transactions in history, and although it has been approved by the European Union, the UK, South Korea, and Japan, it still requires approval from China.

2023-11-23

TSMC plans to build a third factory in Japan to produce 3-nanometer chips

According to insiders, TSMC is considering building a third chip factory in Japan to produce advanced 3-nanometer chips; This may make Japan an important global chip manufacturing center. Insiders said that the chip foundry has informed supply chain partners that it is considering building a third factory in Kumamoto Prefecture, southern Japan, under the project code TSMC Fab-23 Phase III.

2023-11-22

SK Hynix will use its subsidiary's KrF PR for 238 layer NAND flash memory

According to reports, SK Hynix acquired the electronic materials business unit of Jinhu Petrochemical for approximately RMB 2.22 billion in 2020. Recently, according to The Elec, the thick KrF photoresist (PR) developed by SK Hynix has passed the company's quality inspection.

2023-11-21

Apple's self-developed 5G modem has been postponed until the end of 2025

The 5G modem project independently developed by Apple has been highly anticipated, but faces new challenges. According to Bloomberg reporter Mark Gurman's latest Power On newsletter, the release time of Apple's self-developed 5G modem may be delayed again, as early as the end of 2025.

2023-11-20

TSMC Wins Microsoft 5nm AI Chip Order

According to industry insiders, TSMC has received orders for artificial intelligence (AI) chips from major cloud service providers (CSPs), including Microsoft's 5nm chip order.

2023-11-18

Samsung plans to launch 3D AI chip packaging "SAINT" in 2024

As semiconductor microfabrication processes approach the physical limit, advanced packaging technology has become the focus of competition. TSMC is the first to launch the 3Dfabric platform, and Samsung plans to launch the "SAINT" advanced 3D chip packaging technology to catch up.

2023-11-17

Samsung and SK Hynix Q3 semiconductor inventories remain at high levels

The semiconductor libraries of Samsung and SK Hynix also maintained a high level in the third quarter of 2023. According to Samsung's quarterly report, as of the third quarter of 2023, its overall inventory amount was 55.2 trillion won, an increase of 5.9% from 52.1 trillion won at the end of 2022; The inventory amount of semiconductors has significantly increased by 16.1% from 29 trillion won at the end of 2022 to 33.7 trillion won, an increase of more than twice compared to the end of 2021.

2023-11-16

SK Hynix HBM's shipment volume is expected to increase significantly, reaching 100 million by 2030

SK Hynix CEO Jeong ho Park revealed in his speech on the 13th that the company's high bandwidth memory (HBM) shipment this year is 500000 units, and it is expected to reach 100 million units per year by 2030.

2023-11-15

Advanced process competition among wafer foundry giants entering white-hot stage

The advanced process investment of wafer foundry giants stems from the explosion of demand in the chip market. With the promotion of emerging technologies such as AI and high-performance computing, the importance of advanced manufacturing processes in the wafer foundry industry has become increasingly prominent, attracting wafer foundry companies such as TSMC, Samsung, and Intel to accelerate the introduction of more advanced manufacturing technologies to meet the continuous growth of market demand.

2023-11-14

Samsung Releases 2.1D Semiconductor Packaging Technology Cost May Reduce by 22%

Samsung has recently introduced the next generation (2.3D) semiconductor packaging technology to strengthen its competition with Intel and TSMC, which can be used to package high-performance semiconductors such as AI chips. It is reported that this packaging technology can reduce costs by 22% without sacrificing performance.

2023-11-13